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VOLUME -24 NUMBER 10
Publication Date: 10/1/2009
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October 2009 Issue
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BGA Prototyping Adapter from Ironwood
BGA test adapter.
Burnsville, MN — Design engineers using 0.075-in. pitch 117 position BGA ICs will be interested in the release of PA-BGA117C-P-S-01 prototyping adapter from Ironwood Electronics. This new adapter release is a part of the company's high-performance prototyping adapter product line that allows quick prototyping of BGA ICs.
A clam-shell spring pin ZIF socket (SS-BGA117C-01 sold separately) can be used with the prototyping adapter which provides easy access to address and data lines and simplifies IC swap-out. This adapter interfaces the 117-position 0.075-in. pitch BGA SMT land pattern to a 0.100-in. center pin grid array (PGA).
PA-BGA117C-P-S-01 is constructed with gold-plated solder-tail machined pins for maximum reliability when it is plugged into a receptacle or soldered down to a PCB. Optionally, the adapters can be supplied with wire-wrap pins so the prototype can be built on very inexpensive wire-wrap panels.
The SS-BGA117C-01 operates at bandwidths up to 10GHz with less than 1dB of insertion loss. The sockets are designed to dissipate up to several watts without extra heat-sinking and can handle up to 100 watts with custom heat sink. The self inductance of the contactor is typically 0.62nH per pin. The socket connects all pins with 10GHz+ bandwidth on all connections to the proto adapter.
The SS-BGA117C-01 is constructed with high performance and low inductance Spring Pins (pogo) with 500,000 insertion capability. There is 30 grams of force on each ball when the IC is inserted and the lid is actuated. The temperature range is -40 to +150°C. Current capacity on each contactor is 4 amps at ambient temperature. The user simply drops in the BGA chip, turns the screw, and starts testing.
Contact: Ironwood Electronics, Inc., 11351 Rupp Dr.,Suite 400, Burnsville, MN 55337
800-404-0204 or 952-229-8200 fax: 651-452-8400 E-mail: email@example.com Web:
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