Save. Share. Connect.
Wednesday, June 20, 2018
VOLUME -24 NUMBER 10
Publication Date: 10/1/2009
Front Page News
People in the News
Electronic Mfg. Services
Electronic Mfg. Products
Special Features: SMT and Production
Product Preview: productronica
October 2009 Issue
Add Message Board
Brad McCredie & Paul Franzon Keynoters for IMAPS
Washington, DC — Brad McCredie, a Vice President and Fellow at IBM, has agreed to be the featured keynote speaker at IMAPS 2009, the 42nd International Symposium on Microelectronics (IMAPS 2009). The Symposium will be held November 1-5, 2009, at the San Jose Convention Center, San Jose, CA. The symposium is presented by IMAPS, the International Microelectronics And Packaging Society.
Dr. McCredie received his BS, MS, and PhD degrees in electrical and computer engineering from the University of Illinois in 1985, 1987 and 1991 respectively. His primary interests were electromagnetic modeling and simulation. He then joined IBM and continued his work in packaging focused on IBM's mainframe systems. In 1996 he began working on POWER-based systems. His first assignment was on POWER3. He delivered the cache subsystem design and packaging.
Dr. McCredie became one of the lead architects of IBM's POWER4 systems and chip and went on to become the POWER4 system chief engineer and delivered that system in 2001. The POWER4 systems propelled IBM from a trailing position as the #3 Unix system provider in the industry to its current position as the #1 Unix systems supplier.
Led to #1 Benchmark
After delivering the POWER4 systems, McCredie led the design and delivery of the POWER6 processor for IBM. POWER6 is the highest frequency processor in the industry and is the only processor in the industry to earn a #1 benchmark result in all of the major benchmarks including SPEC, TPC-C, SAP and Java. He then focused on POWER7 systems.
After leading the chip design team for over six years, he has taken on the system executive role for POWER7. His responsibilities included delivery of all system components including hardware and software elements. In 2004 Brad was appointed to the position of IBM Fellow, IBM's highest technical position. In 2009 he was appointed to the position of IBM Vice President and Fellow and is now leading all POWER chip development for IBM systems.
MEMs Professor Keynotes
Dr. Paul Franzon is the second Keynote Speaker at IMAPS 2009. Dr.Franzon is currently a Professor of Electrical and Computer Engineering at North Carolina State University. He earned his Ph.D. from the University of Adelaide, Adelaide, Australia in 1988. He has also worked at AT&T Bell Laboratories, DSTO Australia, Australia Telecom and two companies he co-founded — Communica and LightSpin Technologies. His current interests center on the technology and design of complex systems incorporating VLSI, MEMS, advanced packaging and nano-electronics. He has led several major efforts and published over 180 papers in these areas. In 1993 he received an NSF Young Investigators Award, in 2001 was selected to join the NCSU Academy of Outstanding Teachers, in 2003, and selected as a Distinguished Alumni Professor and in 2005 won the Alcoa award. He is a Fellow of the IEEE.
"With the addition of Dr. Franzon, IMAPS 2009 is offering the best possible keynote speakers who are experts in our technologies. Dr. Franzon's background and current field of endeavor gives him the ideal experience that IMAPS 2009 attendees are interested in hearing about," stated Jeff Demmin of Tessera, IMAPS 2009 General Chair.
Business Council Forum
IMAPS 2009 will present the Global Business Council's (GBC) Fall 2009 Forum, Recovery of the Semiconductor Market, on Wednesday, November 4, 2009.
The GBC is proud to present two leading experts in the semiconductor industry, Mr. Andrea Lati of VLSI Research will discuss the State of the Semiconductor Industry, and Mr. Shawn DuBravac, Director of Research at the Consumer Electronics Association, will give CEA's views on the Impact of Consumer Technologies on Semiconductors: Drivers, Disrupters and Developments.
Mr. Lati joined VLSI Research in 2001 and has managed and developed business models, market analysis, and industry forecasts on microelectronics and semiconductor markets. He has performed custom analysis for various clients and is co-author of
The Chip Insider
Mr. DuBravac directs CEA's research on economic analysis and consumer electronics. He manages the analysis of the CE industry including forecasting economic activity, econometric studies and examining trade flows.
"The Global Business Council of IMAPS is pleased to have this important Fall Forum presentation as the recovery of the semiconductor market will drive the packaging industry. IMAPS symposium attendees as well as corporate members will benefit from the insight of these two speakers. It is the role of the GBC to develop programs of this nature to benefit our membership. These speakers bring exceptionally relevant information for everyone involved in the semiconductor industry. The Annual GBC Marketing Forum is one of the most popular events at the IMAPS Annual Symposium. The Marketing Forum is free of charge to everyone at IMAPS 2009, including those who just visit the exhibit hall. The recent economy has wreaked havoc in many areas in our industry and the information that will be presented by these two experts will add insights as to what is current and what lies ahead," stated Greg Caswell, Director of Engineering at RNT, Inc., and Chair of the Global Business Council.
Contact: IMAPS, 611 2nd St. N.E., Washington, DC 20002
202-548-4001 fax: 202-548-6115 Web:
© 2015 USTECH. All Rights Reserved. |
Contact Us: 610-783-6100 | email@example.com
powered by GIM