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Rogers Intros Lite Laminates for Low-Loss Antennas
RoHS-compliant PCB laminates.
Chandler, AZ — The Advanced Circuit Materials (ACM) Division of Rogers Corp. has introduced RO4730 LoPro laminates for base station, RFID and other antenna designs. The new laminate materials combine low-loss dielectric with low-profile copper foil for reduced passive intermodulation (PIM) and low insertion loss.

The specially formulated RO4730 LoPro thermoset resin system incorporates a hollow microsphere filler to achieve a low weight, light density laminate, which is approximately 30 percent lighter weight than woven-glass PTFE materials. The new laminates have a matched dielectric constant of 3.0, providing a much lower-cost solution for high frequency circuit boards used in base station and other antennas.

The laminates have a low Z-axis coefficient of thermal expansion (CTE) of about 40PPM/°C) for design flexibility. With a temperature coefficient of dielectric constant of about 23 PPM/°C, the laminates provide consistent circuit performance over short term temperature ranges. They have the same high glass transition temperature (Tg) as the company's other high-performance RO4000® laminates, greater than 280°C, making them lead-free and automated assembly compatible.

RO4730 LoPro RoHS-compliant laminates are compatible with standard PCB fabrication techniques and plated-through-hole (PTH) processing. Designed for base station and other RFID antennas, the proprietary, halogen-free laminates support longer drill tool lifetimes than other filled materials, reducing fabrication costs.

Contact: Rogers Corporation, P.O. Box 188, Rogers, CT 06263-0188 860-774-9605 fax: 860-779-5509 Web:
http://www.rogerscorp.com

See at IPC Midwest Booth #502.

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