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Wednesday, August 31, 2016
VOLUME -24 NUMBER 9
Publication Date: 09/1/2009
Front Page News
People in the News
Electronic Mfg. Services
Electronic Mfg. Products
Special Features: PCB and Assembly
Product Preview: ATE and IPC Midwest
September 2009 Issue
Electronic Mfg. Products
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Techspray Unveils Green Non-Polluting Cleaners
Stencil cleaning made easy with new cleaners.
Amarillo, TX — Techspray has introduced its ecologically-friendly Techspray Renew
products that take advantage of current "green" technology, and still maintain the cleaning strength typically available from the company's products.
The new cleaning product reportedly has low ecological impact, with low VOCs and no global warming impact. The cleaner is sustainable and biodegradable, using materials such as corn-based ethanol, seed oils, soy-based oils, and citrus-based oils.
Even the packaging is made of recycled/recyclable materials. The packaging is fully compliant with California CARB and similar restrictions, and meets European REACH and WEEE requirements. Designed specifically for electronic applications, ECO-STENCIL
Cleaner and ECO-OVEN
Cleaner are both effective, safe and eco-friendly, and are non-flammable, biodegradable, low VOC — zero GWP, and non-ozone depleting.
The cleaner effectively removes all types of solder paste — water-based, RMA, no-clean, lead-free — as well as uncured adhesive from screens, misprinted boards, and equipment. It is completely safe on stencils, squeegees, and equipment surfaces. The cleaner is a suitable replacement for isopropyl alcohol (IPA), which is often restricted because of safety and environmental restrictions on VOC emissions or waste disposal issues. The cleaner is designed for manual stencil tool, work surface and squeegee cleaning, and for automatic underside wipe stencil cleaning. It removes unsoldered eutectic (leaded) and lead-free solder pastes and is excellent for cleaning off uncured adhesives. It is not designed for use in automatic stencil washers.
ECO-OVEN Cleaner cleans reflow ovens, wave soldering systems, and associated heat exchanger systems by removing all types of flux residues — water-based, RMA, no-clean, lead-free. It is used for periodic preventive maintenance to keep equipment performing at peak levels and is fast-acting and more effective than IPA for baked-on flux residues. The cleaner is excellent for removal of baked-on flux residues from SMT oven and wave solder equipment. It also is recommended for use in all brands of wave solder equipment and for use in periodic preventive maintenance of SMT ovens and wave solder equipment.
Contact: Techspray, P.O. Box 949, Amarillo, TX 79105
800-858-4043 fax: 806-372-8750 E-mail: firstname.lastname@example.org Web:
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