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Tuesday, February 21, 2017
VOLUME -24 NUMBER 9
Publication Date: 09/1/2009
Front Page News
People in the News
Electronic Mfg. Services
Electronic Mfg. Products
Special Features: PCB and Assembly
Product Preview: ATE and IPC Midwest
September 2009 Issue
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Samtec Releases Micro Backplane Design Guide
Micro backplane design guide.
New Albany, IN — Samtec has released its new Micro Backplane Design Guide detailing how the company's high Speed and High Density Board-to-Board and Panel-and-I/O interface solutions can be used for add-on boards, creative packaging solutions, and for increasing I/O density.
Board-to-Board solutions include perpendicular and co-planar applications for high speed edge card (HSEC8 Series) and the company's rugged two-piece EdgeRate
connector system (ERM8/ERF8 Series.) High density solutions are addressed with SEARAY
(SEAM/SEAF Series) open pin field arrays, while Q2
integrated ground plane connectors (QMS/QFS Series) address traditional power and ground applications within high speed interconnects.
Creative I/O solutions are shown that can increase panel density and/or achieve I/O flexibility. Coax cable and high-speed flex jumper solutions can route signals from the back of the box to the front panel; they can also be used to by-pass traditional backplanes. The company's True75
BNC and micro backplane solutions for 3G SDI broadcast video are also illustrated.
Contact: Samtec, Inc., P.O. Box 1147, New Albany, IN 47151-1147
800-726-8329 or 812-944-6733 fax: 812-948-5047 E-mail: email@example.com Web:
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