Save. Share. Connect.
Tuesday, February 21, 2017
VOLUME -24 NUMBER 9
Publication Date: 09/1/2009
Front Page News
People in the News
Electronic Mfg. Services
Electronic Mfg. Products
Special Features: PCB and Assembly
Product Preview: ATE and IPC Midwest
September 2009 Issue
Add Message Board
Fujitsu Releases Vertical-Mount SMT DIMM Socket
Sunnyvale, CA — Fujitsu Components America, Inc. has introduced a vertical, surface-mount DDR2 (double data rate) DIMM (dual in-line memory module) socket connector with an enhanced contact design and 0.1mm lead coplanarity.
The new 240-position, FCN-078J series card-edge socket has a patented, split-beam contact structure that improves module mating reliability. As a memory module is inserted into the socket, the twin-contact's wiping action removes dust and flux residue and provides a robust connection between the module and socket even in high-vibration environments. Dual latching mechanisms ensure correct module retention and removal.
The RoHS-compliant sicjet uses the company's own precision stamping and molding technology to achieve 0.1mm coplanarity before and after reflow. This low-coplanarity specification contributes to improved manufacturing throughput yields. Applications include blade servers, switches, routers, telecom racks, and test and measurement equipment to minimize occupied board space and improve air flow.
The socket is 22.7mm high x 140mm long. It has an operating temperature range of -55 to +85°C, a voltage rating of 25VAC and a maximum current rating of 0.5A per contact. Heat resistant tape on the top of the connector facilitates use with pick-and-place equipment. Solder bars in the middle and on the outside edges of the connector assure accurate IR processing when soldering the connector to the PCB.
Contact: Fujitsu Components America Inc., 250 E. Caribbean Drive, Sunnyvale, CA, 94089
800-380-0059 E-mail: email@example.com Web:
© 2015 USTECH. All Rights Reserved. |
Contact Us: 610-783-6100 | firstname.lastname@example.org
powered by GIM