Wednesday, August 24, 2016
VOLUME -24 NUMBER 9
Publication Date: 09/1/2009
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ARCHIVE >  September 2009 Issue >  Partnering > 
How Partial Underfilms Help BGAs


Lead-free assembly has created a difficult hurdle for the PCB assembly process, especially for CSP and BGA packages. Current soldering technology requirements for RoHS compliance requires brittle alloys, which along with miniaturization, is reducing joint sizes and prematurely fatiguing ...

 
 
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