Monday, April 23, 2018
VOLUME -24 NUMBER 9
Publication Date: 09/1/2009
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Archive >  September 2009 Issue >  Front Page News > 
Breakthrough May Bring New Gen PC Boards

Syracuse, NY — Circuit boards may get a whole new pedigree and production methodology because of an amazing discovery by PCB veteran Robert Tarzwell working in his laboratory at DMRPCB — literally a cottage industry site. It's the stuff of Silicon Valley garage startups: Tarzwell has made a momentous
discovery that can revolutionize the way printed circuits are fabricated. At the same time, this new ... Read More
New Hydrogen Storage Brings Fuel Cell Autos Closer

Los Alamos, NM — With every announcement of another automobile manufacturer's fuel cell initiative come wonderful pronouncements and forecasts that are still far from being fulfilled for a number of reasons. One of these over-arching stumbling blocks has been the lack of a suitable fuel storage system for pure ...Read More
IPC Study: Industry Gaining Strength

Bannockburn, IL — IPC has released the results of its latest Fast Facts survey, "Survival Strategies and Success Measures in the Electronics Industry". With data from a representative sample of electronics OEMs, EMS companies, PCB manufacturers and suppliers, the survey reveals the strategies companies are ...Read More


 
 
SMTA Europe's Harsh Environments Conference Session 7 to Focus on Hi-Temp Mats/Fab
SMTA Europe announces Session 7 Technical Program on High Temperature PCB Materials and Fabrication at the “Electronics in Harsh Environments Conference” to be held in Amsterdam, Netherlands, on April 25th, 2018.      
EOS WLC550 series offers maximum Cooling Flexibility on Standard Footprint
Last week at the MT-CONNECT in Nuremberg more than 150 companies from the European MedTec Business met for discussing the latest trends and guidelines in MedTec industry. When EOS power presented its medical up to class-2 powersupplies at MT-CONNECT, the EOS team made an exciting observation: While everyone is still talking about the size of the powersupplies, which is still very true for home devices, the real crucial factor for sales support for larger devices at the MT connect was the cooling.   
SEMI and TechSearch International Report Global Semiconductor Packaging Materials Market Reaches $16.7 Billion

MILPITAS, CA SEMI, the industry association representing the global electronics manufacturing supply chain, and TechSearch International today reported that the global semiconductor packaging materials market reached $16.7 billion in 2017. While slower growth of smartphones and personal computers – the industry’s traditional drivers – is reducing material consumption, the slowdown was offset by strong unit growth in the cryptocurrency market in 2017 and early 2018. Flip chip package shipments into the cryptocurrency market, while providing a windfall to many suppliers, are not expected to remain at high levels.  


C&K ANNOUNCES THAT IT HAS ACQUIRED VUILLERMOZ
Newton, MA – C&K, one of the world’s most trusted brands of high-quality electromechanical switches, today announces that it has acquired the company Vuillermoz, a micro-mechanical components and tooling company located in St. Claude, France.



 
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