Save. Share. Connect.
Friday, December 15, 2017
VOLUME -24 NUMBER 9
Publication Date: 09/1/2009
Front Page News
People in the News
Electronic Mfg. Services
Electronic Mfg. Products
Special Features: PCB and Assembly
Product Preview: ATE and IPC Midwest
September 2009 Issue
Front Page News
Breakthrough May Bring New Gen PC Boards
Syracuse, NY — Circuit boards may get a whole new pedigree and production methodology because of an amazing discovery by PCB veteran Robert Tarzwell working in his laboratory at DMRPCB — literally a cottage industry site. It's the stuff of Silicon Valley garage startups: Tarzwell has made a momentous
discovery that can revolutionize the way printed circuits are fabricated. At the same time, this new ...
New Hydrogen Storage Brings Fuel Cell Autos Closer
Los Alamos, NM — With every announcement of another automobile manufacturer's fuel cell initiative come wonderful pronouncements and forecasts that are still far from being fulfilled for a number of reasons. One of these over-arching stumbling blocks has been the lack of a suitable fuel storage system for pure ...
IPC Study: Industry Gaining Strength
Bannockburn, IL — IPC has released the results of its latest Fast Facts survey, "Survival Strategies and Success Measures in the Electronics Industry". With data from a representative sample of electronics OEMs, EMS companies, PCB manufacturers and suppliers, the survey reveals the strategies companies are ...
SEMI: North American Semiconductor Equipment Industry Posts November 2017 Billings
MILPITAS, CA - North America-based manufacturers of semiconductor equipment posted $2.05 billion in billings worldwide in November 2017 (three-month average basis), according to the November
Equipment Market Data Subscription
(EMDS) Billings Report published today by SEMI.
Avnet Sponsors The Not Impossible Awards Recognizing Emerging Technologies that Improve Lives
Avnet, a leading global technology distributor, today announced its title sponsorship of The Not Impossible Awards, which recognizes the breakthrough achievements of innovators who share the Not Impossible Labs mission to create inventive technology that improves the well-being of others.
aveni® S.A. Extends Copper Interconnects to 5nm and Below for BEOL Integration Using Innovative Electroplating Chemistry
MASSY, France - aveni S.A., developer and manufacturer of market-disrupting wet deposition technologies and chemistries for 2D interconnects and 3D through silicon via packaging, today announced it has obtained results that strongly support the continued use of copper in the back end of line (BEOL) for advanced interconnects, at and beyond the 5nm technology node.
Kilopass NVM OTP IP Achieves 3-Lot Qualification on GLOBALFOUNDRIES 14nm LPP (Low Power Process) Process Technology
SAN JOSE, CA - Kilopass Technology Inc., a leading provider of semiconductor logic embedded non-volatile memory (eNVM) intellectual property (IP), today announced that it successfully achieved a three-lot qualification on GLOBALFOUNDRIES (GF) 14nm LPP (Low Power Process) technology platform for its one-time programmable (OTP) NVM technology.
© 2015 USTECH. All Rights Reserved. |
Contact Us: 610-783-6100 |
powered by GIM