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Monday, March 27, 2017
VOLUME -24 NUMBER 8
Publication Date: 08/1/2009
Front Page News
People in the News
Electronic Mfg. Services
Electronic Mfg. Products
Special Features: Test and Measurement
Product Preview: ATE and IPC Midwest
August 2009 Issue
Front Page News
NIST: Passing the Neutron Science Torch
Gaithersburg, MD — What do the mystery of how proteins fold, the unexpected behavior of nanoparticles, and the key to making hydrogen fuel cells have in common? All can be investigated with beams of slow-moving neutrons — and scientists at the National Institute of Standards and Technology (NIST ...
Printed Electronics Using More Inorganics
By Raghu Das, CEO, IDTechEx, www.IDTechEx.com
Printed electronics is using more inorganics and composites in the quest for higher performance, lower costs, finer feature size, stretchability and creation of radically new components such as memristors, supercabatteries and metamaterials. Here is what some developers and suppliers have been up ...
IEEE Industry Standards: New Program to ID Software
Piscataway, NJ — The IEEE Industry Standards and Technology Organization (ISTO) has established a new program focused on revolutionizing software asset management by effective implementation of standards — TagVault.org.
European SEMI Award Honors Advanced Packaging Technologists
MUNICH, GERMANY - At the SEMI Industry Strategy Symposium in Munich, SEMI announced recipients of the European SEMI Award for 2016:
, deputy director of the Fraunhofer IZM;
, fellow and program director of 3D System Integration at imec; and
SHENMAO America, Inc. Introduces Omega Aleaciones S.A. de C.V. the Exclusive Mexico Distributor of SHENMAO Solder Paste & Flux
JALISCO, MEXICO - Omega Aleaciones S.V. Sales and Application Engineering Team reinforces SHENMAO’s commitment to providing our worldwide EMS and OEM customers with the highest quality and technical solutions Solder Paste to meet the challenges of today’s SMT Assembly and Product Reliability throughout Mexico.
MEMS & Sensors Industry Group Tackles Technical Challenges at Annual Technical Congress: May 10-11 at Stanford University (Stanford, CA)
PITTSBURGH, PA - Microelectromechanical systems (MEMS) and sensors suppliers are targeting a rapidly growing global market for their devices, key components that increase the intelligence and interactivity of billions of electronic products.
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