Wednesday, May 23, 2018
VOLUME -24 NUMBER 8
Publication Date: 08/1/2009
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Archive >  August 2009 Issue >  Front Page News > 
NIST: Passing the Neutron Science Torch

Gaithersburg, MD — What do the mystery of how proteins fold, the unexpected behavior of nanoparticles, and the key to making hydrogen fuel cells have in common? All can be investigated with beams of slow-moving neutrons — and scientists at the National Institute of Standards and Technology (NIST ...
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Printed Electronics Using More Inorganics


Printed electronics is using more inorganics and composites in the quest for higher performance, lower costs, finer feature size, stretchability and creation of radically new components such as memristors, supercabatteries and metamaterials. Here is what some developers and suppliers have been up ...Read More
IEEE Industry Standards: New Program to ID Software

Piscataway, NJ — The IEEE Industry Standards and Technology Organization (ISTO) has established a new program focused on revolutionizing software asset management by effective implementation of standards — TagVault.org. Read More


 
 
SEMICON WEST Adds WT | Wearable Technologies Conference Co-Location: Premier U.S. electronics manufacturing event expands with wearables program
MILPITAS, CA - SEMI, the global industry association representing the electronics manufacturing supply chain, today announced that the WT | Wearable Technologies Conference 2018 USA will co-locate July 11-12 with SEMICON West 2018 in San Francisco.         
Flex Power Modules announces new BGA packaging option for digital point-of-load DC/DC converters
Flex Power Modules today announced that its BMR466 and BMR461 digital point-of-load (POL) DC/DC power modules are now available to customers with BGA (Ball Grid Array) packaging, as well as in their original compact LGA (Land Grid Array) package.        
Atotech to present Spherolyte® CU UF3 for fine line RDL at ECTC 2018
BERLIN, GERMANY - Atotech is pleased to announce its partaking in the Electronics Components and Technology Conference (ECTC) 2018. As a gold sponsor, Atotech will participate with two presentations and a booth, highlighting its latest solutions for flexible electronics as well as fan-out wafer-level and fan-out panel-level packaging.    
 
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