Tuesday, May 22, 2018
Publication Date: 07/1/2009
Archive >  July 2009 Issue >  Product Preview: Semicon West > 

Asymtek Intros Fids-on-the-Fly Technology
Fast fiducialfinding dispensing system.
Carlsbad, CA — Asymtek, a Nordson company, is demonstrating its new Fids-on-the-Fly option for its Spectrum S-900N series dispensing platforms. With Fids-on-the-Fly the substrate is scanned in one pass to locate fiducials prior to the jet dispensing operation. The camera is always in motion, snapping images on the fly. It is up to 5.5 times faster than traditional stop-and-capture modes for locating fiducials. Reducing time spent performing this essential, non-dispense routine can increase units per hour (UPH) of completed parts by as much as 35 percent.

Fiducials are used to identify the location of parts prior to dispensing and can compensate for skew on individual parts within a workpiece. In stop-and-capture mode, the camera must pause to locate each fiducial, so the more fiducials, the longer it takes. In the semiconductor industry, Fids-on-the-Fly can be used for die-to-wafer alignment for 3-D stacking or for large boards for package-on-package. Fids-on-the-Fly is useful on almost any application where a large number of alignment marks or fiducials need to be found, such as production of lateral flow sensors used in medical applications. In operation, the company's FmXP software calculates a spline travel path based on the programmed fiducial locations in the dispense program. Once the path is calculated, image-capture is performed at maximum acceleration and velocity without stopping. Fids-on-the-Fly uses a high-speed digital camera that operates at 60 frames/second. High-intensity on-axis LED light with adjustable red, green and blue (RGB) light levels enable reliable fiducial capture for even the most difficult applications.

The Spectrum S-900N Series dispensing system is designed with maximum flexibility and is configurable for a wide variety of applications. It is designed for high-volume applications such as edge- and corner-bonding that do not require heat, or can be configured with up to three heat stations for applications that need heat, such as flip chip and CSP underfill. The platform can be configured with single or dual lanes depending on capacity and footprint requirements. As process needs change, the system can be upgraded in the field to add necessary options.

Contact: Asymtek, 2762 Loker Ave. W., Carlsbad, CA 92008 800-279-6835 or 760-431-1919 fax: 760-431-2678 E-mail: info@asymtek.com Web:

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