Monday, October 23, 2017
VOLUME -24 NUMBER 7
Publication Date: 07/1/2009
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Archive >  July 2009 Issue >  Front Page News > 
Graphene Nano Wires May Help IC Performance


Atlanta, GA — The unique properties of thin layers of graphite — known as graphene — make the material attractive for a wide range of potential electronic devices. Researchers have now experimentally demonstrated the potential for another graphene application: replacing copper ...
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Semicons Driving Force for Energy Efficiency

Washington, DC — Semiconductor technologies are so essential to advances in energy efficiency gains that the U.S. economy could expand by more than 70 percent through 2030 and still use 11 percent less electricity than it did in 2008. This is part of the findings of a major news study by the nonprofit and independent ...Read More
Shape Matters for Cobalt Nanoparticles

Gaithersburg, MD — Shape is turning out to be a particularly important feature of some commercially important nanoparticles — but in subtle ways. New studies by scientists at the National Institute for Standards and Technology (NIST) show that changing the shape of cobalt nanoparticles from spherical to ... Read More


 
 
European Space Agency approval for Ventec material in Amphenol Invotec rigid & flex-rigid production

Amphenol Invotec, one of Europe’s leading manufacturers of complex printed circuit boards (PCBs), and Ventec International, a world leader in the production of polyimide & high reliability epoxy laminates and prepregs, are delighted to announce that Ventec's VT-901 polyimide material is now fully qualified by ESA in Amphenol Invotec’s manufacturing process for rigid and Flex-rigid PCBs.


New Dry Film Negative Photoresist for MEMS and Wafer-Level Packaging

DELAWARE, OH Engineered Material Systems, Inc., a leading global supplier of negative photo resist materials for MEMS and TSV passivation/sealing applications, is pleased to introduce the DF-2005 dry-film negative photo resist for use in micro-electro mechanical systems (MEMS), wafer-level packaging and CMOS applications (metallization). This material formulation has been optimized for hot roll lamination and processing on MEMS and IC wafers.


 
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