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Tuesday, May 23, 2017
VOLUME -24 NUMBER 7
Publication Date: 07/1/2009
Front Page News
People in the News
Electronic Mfg. Services
Electronic Mfg. Products
Special Features: Assembly and Packaging
Product Preview: Semicon West
July 2009 Issue
Front Page News
Graphene Nano Wires May Help IC Performance
By John Toon, Georgia Institute of Technology, Atlanta, GA
Atlanta, GA — The unique properties of thin layers of graphite — known as graphene — make the material attractive for a wide range of potential electronic devices. Researchers have now experimentally demonstrated the potential for another graphene application: replacing copper ...
Semicons Driving Force for Energy Efficiency
Washington, DC — Semiconductor technologies are so essential to advances in energy efficiency gains that the U.S. economy could expand by more than 70 percent through 2030 and still use 11 percent less electricity than it did in 2008. This is part of the findings of a major news study by the nonprofit and independent ...
Shape Matters for Cobalt Nanoparticles
Gaithersburg, MD — Shape is turning out to be a particularly important feature of some commercially important nanoparticles — but in subtle ways. New studies by scientists at the National Institute for Standards and Technology (NIST) show that changing the shape of cobalt nanoparticles from spherical to ...
Ventec: Thomas Michels to Speak at the EIPC Summer Conference
SUZHOU, CHINA - Ventec's European Managing Director Thomas Michels will speak at EIPC Summer Conference on June 1st & 2nd, 2017 to be held at the Best Western Plus Manor Hotel, Solihull, UK.
Indium Corporation’s Mackie to Present at IMAPS ATW on Advances in Semiconductor Packaging
CLINTON, NY - Indium Corporation’s
Andy C. Mackie, PhD, MSc
, Senior Product Manager for Semiconductor and Advanced Assembly Materials, will present at the
IMAPS Advanced Technology Workshop and Tabletop Exhibition on Advances in Semiconductor Packaging
on June 15 at Binghamton University in Vestal, N.Y.
Dr. Mike Bixenman Discusses Non-Standard Test Methods at ICSR
NASHVILLE, TN - KYZEN is pleased to announce that Mike Bixenman, DBA will present at the International Conference on Soldering & Reliability (ICSR) held in conjunction with the Toronto SMTA Expo & Tech Forum.
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