Monday, December 5, 2016
VOLUME -24 NUMBER 7
Publication Date: 07/1/2009
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Archive >  July 2009 Issue >  Front Page News > 
Graphene Nano Wires May Help IC Performance


Atlanta, GA — The unique properties of thin layers of graphite — known as graphene — make the material attractive for a wide range of potential electronic devices. Researchers have now experimentally demonstrated the potential for another graphene application: replacing copper ...
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Semicons Driving Force for Energy Efficiency

Washington, DC — Semiconductor technologies are so essential to advances in energy efficiency gains that the U.S. economy could expand by more than 70 percent through 2030 and still use 11 percent less electricity than it did in 2008. This is part of the findings of a major news study by the nonprofit and independent ...Read More
Shape Matters for Cobalt Nanoparticles

Gaithersburg, MD — Shape is turning out to be a particularly important feature of some commercially important nanoparticles — but in subtle ways. New studies by scientists at the National Institute for Standards and Technology (NIST) show that changing the shape of cobalt nanoparticles from spherical to ... Read More


 
 
Murphy, Choh and Pilla Join ClassOne Technology's Board of Advisors
KALISPELL, MT - ClassOne Technology (www.classone.com), manufacturer of advanced wet processing equipment for ≤200mm substrates announced the formation of a Board of Advisors. This body will be made up of highly-regarded senior executives from the semiconductor industry who will provide their perspective and guidance to ClassOne as it navigates the expansion of its operations.
 

Indium Corporation’s Karch Recognized for Best Presentation at IMAPS Autumn Conference 2016
CLINTON, NY - Indium Corporation’s Andreas Karch, Regional Technical Manager for Germany, Austria and Switzerland, was recognized for his technical presentation at the IMAPS Autumn Conference in October in Munich, Germany.

Karch was awarded “Best Presentation” for the session New Solder Material Technology in the Manufacturing Process of IGBT Modules, which discussed a new method that produces strong, reliable solder joints that resist cracking and thermal fatigue.

Ventec International Group Focus On High Thermal Performance Materials for Automotive and LED Applications at HKPCA 2016, China
SUZHOU, CHINA - Ventec International Group, a world leader in the production of polyimide & high reliability epoxy laminates and prepregs, will exhibit in Booth #4B16 at HKPCA, China, scheduled to take place December 7th-9th, 2016 at the Shenzhen Convention & Exhibition Center, China.

 
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