-
HOME
CURRENT ISSUE
ARCHIVE
WHITE PAPERS
ABOUT US
SUBSCRIBE
MEDIA KIT
中文
Login
Hi-Tech Events
Search :
Thursday, March 18, 2010
June 2009 Issue
Front Page News
Tech-Op-Ed
Tech Watch
People in the News
Business News
Management
Electronic Mfg. Services
Electronic Mfg. Products
Production
Partnering
Distribution
Special Features: Components and Distribution
Product Preview: Atlantic Design/MDM
New Products
Hi-Tech Events
Calendar
U.S. Tech Part Search
Powered by
Terms Of Use
Folder
Article
Weblink
Product
Forum Topic
Calendar
Form
Document
Album
Podcast
IPC: APEX Call for Papers
Bannockburn, IL — IPC has announced its 2010 APEX event with a call for papers and participation. The Association is requesting that technical experts and industry leaders submit abstracts for the 2010 IPC APEX EXPO at Mandalay Bay Resort and Convention Center, Las Vegas, April 6-9, 2010.
IPC APEX EXPO is described as the world's premier conference and exhibition for the electronic interconnect industry — developed and presented by the industry for the industry — and provides presenters and their companies with a notable and cost-effective opportunity to promote their expertise and gain visibility with key engineers, managers and executives worldwide. To recognize exceptional achievement, awards will be presented for "Best U.S. Paper" for U.S. authors and the "Best International Paper" for authors from outside the United States.
Expert presentations are being sought on all relevant electronics design, PCB fabrication and manufacturing topics. Submissions in the areas of package on package assembly, printable electronics and advanced substrates are especially encouraged. A 300-word abstract summarizing original and previously unpublished work covering case histories, research and discoveries must be submitted by July 17, 2009. The submission should describe significant results from experiments, emphasize new techniques, discuss trends of interest and contain a summary of the technical and/or appropriate test results in the final paper.
Proposals are also solicited for full-day and half-day professional development courses on design, printed board and electronic manufacturing processes and materials.
All abstracts and proposals are due July 17, 2009. To submit an abstract or proposal, visit
http://www.IPCAPEXEXPO.org/call-for-papers
. For more information about conference presentations, contact Toya Richardson, IPC technical administrative assistant, at ToyaRichardson@ipc.org or 847-597-2825. For course proposal information, contact Anne Marie Mulvihill, IPC professional development program manager at AnneMarieMulvihill@ipc.org or 847-597-2827.
search
login