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Friday, August 26, 2016
VOLUME -24 NUMBER 6
Publication Date: 06/1/2009
Front Page News
People in the News
Electronic Mfg. Services
Electronic Mfg. Products
Special Features: Components and Distribution
Product Preview: Atlantic Design/MDM
June 2009 Issue
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Fujipoly Intros Easy Release Thermal Gap Pads
Thermal gap filler.
Carteret, NJ — Fujipoly has introduced a specially formulated thermal interface gap pad that simplifies board-level maintenance by dramatically reducing material tearing during disassembly for re-work and repair.
The company's Sarcon
GR-H and XR-H thermal interface materials are made with an unusual hardened top surface. This one-sided surface treatment is less tacky than the opposing contact side, allowing the thermal pad to consistently adhere to either the electrical component or opposing heat sink. The hard surface quickly and easily releases from its component without tearing or damage. GR-H and XR-H gap filler materials are available in eight different formulations and offer thermal conductivity from 1.2 to 17.0W/mxK. Sarcon Hardened Surface interface materials easily conform to uneven components to make complete, reliable thermal transfer contact. These gap fillers are available in sheets with thicknesses from 0.5mm to 5.0mm up to a maximum 200 x 300mm.
Contact: Fujipoly America Corporation, P.O. Box 119, Carteret, NJ 07008
732-969-0100 fax: 732-969-3311 E-mail: email@example.com Web:
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