Save. Share. Connect.
Monday, May 30, 2016
VOLUME -24 NUMBER 6
Publication Date: 06/1/2009
Front Page News
People in the News
Electronic Mfg. Services
Electronic Mfg. Products
Special Features: Components and Distribution
Product Preview: Atlantic Design/MDM
June 2009 Issue
Electronic Mfg. Products
Add Message Board
Koh Young: New 3D AOI Technology
3D AOI inspection system.
Seoul, Korea — Koh Young Technology has launched a new family of Automated Optical Inspection (AOI) systems, the Koh Young Zenith series.
According to the company, these new systems incorporate recently developed 3D inspection technology. The system's technology "breaks the 2D AOI inspection barrier" by incorporating the ability to sense and measure the Z-axis profilometry of whole assembled PC board surfaces, including electronic components, solder joints, patterns, holes, and even components with foreign material on them. The 3D capability operates in addition to full conventional 2D AOI; thus, it eliminates the traditional shortcomings of 2D AOI which make it vulnerable to false calls and inspection errors.
In explaining the system details, a company spokesperson said that 2D imaging is the commonly-used technology in AOI inspection systems, but it has a number of shortcomings that are well known to users, such as false calls, escapes and long programming times. Until now, a better technology has not been available, but that has changed with the introduction of the Zenith system.
The new system combines 3D measurement with 2D AOI technology. The ability to measure the height and shape of components and shiny solder joints allows a true comparison with the IPC 610 Acceptability Standard. Thus, there is no question regarding the acceptability of the solder joint.
With its 3D technology, Zenith easily detects not only all kinds of solder joint defects based on their true profilometry, but also simple defects such as tombstoning and has no problems measuring dark components, lifted leads or mislocated devices without any confusion. Programming is simple enough to require less than 30 minutes, because the new system automatically extracts all the necessary information about the components to be inspected by APLB (Automatic Package Library Builder). The full capability of measuring solder joints and components themselves enables APLB to fill out all the necessary three-dimensional parameters for 3D inspection.
Contact: Koh Young technologies Inc., F14, ACE Techno X, 470-5 Gasan-dong, Geumcheon-gu, Seoul, Korea (153-789)
82-2-6670-5000 fax: 82-2-6670-5001 E-mail: firstname.lastname@example.org Web:
© 2015 USTECH. All Rights Reserved. |
Contact Us: 610-783-6100 | email@example.com
powered by GIM