Saturday, July 30, 2016
VOLUME -24 NUMBER 5
Publication Date: 05/1/2009
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ARCHIVE >  May 2009 Issue >  Electronic Mfg. Products > 
Seica: Flying Prober for Speed & Versatility

Salem, NH — The Pilot V8 is the latest addition to Seica's complete line of flying probe test systems and represents a radical departure from traditional flying prober designs. It was named to be included in the Innovative Technology Center (ITC) at the 2008 IPC Printed Circuits Expo in last year ...
SemiProbe Expands Probe System

Colchester, VT — SemiProbe has introduced the new programmable stage series for its patent pending flexible Probe System for Life (PS4L). With the addition of these stages, the PS4L is able to grow and transform as the user's needs and budget grow.
Three-Way Collaboration Advances Copper Interconnect Technology

Danbury, CT — Novellus Systems, ATMI, Inc., and Enthone Inc. have introduced ViaForm® Extreme Pura — a new copper deposition process and chemistry for manufacturing advanced copper interconnects at 32 nanometers (nm) and beyond. This new process technology reportedly provides a high degree ...
YESTech Intros New Technology 3-D X-Ray

Carlsbad, CA — YESTech, a subsidiary of Nordson Corporation has introduced its new technology 3-D X-Ray and AOI inspection solutions for populated printed circuit boards.
YXLON Intros Highly Flexible X-Ray System

Garbsen, Germany — YXLON International GmbH is introducing the Y.Cheetah to its range of FeinFocus Solutions. The new system reportedly offers effortless high-quality X-ray imaging via 1-click solutions for a wide range of continuously changing inspection tasks.
 
 
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