Thursday, May 24, 2018
VOLUME -24 NUMBER 5
Publication Date: 05/1/2009
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Archive >  May 2009 Issue >  Front Page News > 
Green Power: Converting Waste Heat

Durham, NC — Generating clean power from waste heat is gaining significant attention worldwide. One way is to use thermoelectric modules to convert the heat energy directly to electricity. There is a direct link between TE module performance, in terms of efficiency, and the applicability of TEs in ...
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NIST to Help Fund Best R&D

Gaithersburg, MD — The National Institute of Standards and Technology (NIST) has set in motion a 2009 competition for multiyear research funding in two major areas of national interest, civil infrastructure and manufacturing, under its Technology Innovation Program (TIP). TIP expects to provide cost-shared ...Read More
Sunburst EMS Building Unique Energy Product

West Bridgewater, MA — You've probably seen them in WW II movies, where patriots in the Philippines or other South Pacific locations behind enemy lines would power a clandestine radio transmitter by pedaling on a bicycle/electric generator. Fast forward more than 60 years and such a machine is now part of something ...Read More


 
 
Indium Corporation Expert to Present at PCIM Europe
CLINTON, NY - Indium Corporation expert, Karthik Vijay, Technical Manager, Europe, Africa, and the Middle East, will present at PCIM Europe on Wednesday, June 6, in Nuremberg, Germany.

Vijay will present Improve Reliability and Bondline Control with InFORMS® and Indalloy®276.
 

SEMICON WEST Adds WT | Wearable Technologies Conference Co-Location: Premier U.S. electronics manufacturing event expands with wearables program
MILPITAS, CA - SEMI, the global industry association representing the electronics manufacturing supply chain, today announced that the WT | Wearable Technologies Conference 2018 USA will co-locate July 11-12 with SEMICON West 2018 in San Francisco.         
Flex Power Modules announces new BGA packaging option for digital point-of-load DC/DC converters
Flex Power Modules today announced that its BMR466 and BMR461 digital point-of-load (POL) DC/DC power modules are now available to customers with BGA (Ball Grid Array) packaging, as well as in their original compact LGA (Land Grid Array) package.        
Atotech to present Spherolyte® CU UF3 for fine line RDL at ECTC 2018
BERLIN, GERMANY - Atotech is pleased to announce its partaking in the Electronics Components and Technology Conference (ECTC) 2018. As a gold sponsor, Atotech will participate with two presentations and a booth, highlighting its latest solutions for flexible electronics as well as fan-out wafer-level and fan-out panel-level packaging.    
 
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