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Tuesday, May 23, 2017
VOLUME -24 NUMBER 5
Publication Date: 05/1/2009
Front Page News
People in the News
Electronic Mfg. Services
Electronic Mfg. Products
Special Features: Test and Measurement
Product Preview: EDS
May 2009 Issue
Front Page News
Green Power: Converting Waste Heat
Durham, NC — Generating clean power from waste heat is gaining significant attention worldwide. One way is to use thermoelectric modules to convert the heat energy directly to electricity. There is a direct link between TE module performance, in terms of efficiency, and the applicability of TEs in ...
NIST to Help Fund Best R&D
Gaithersburg, MD — The National Institute of Standards and Technology (NIST) has set in motion a 2009 competition for multiyear research funding in two major areas of national interest, civil infrastructure and manufacturing, under its Technology Innovation Program (TIP). TIP expects to provide cost-shared ...
Sunburst EMS Building Unique Energy Product
West Bridgewater, MA — You've probably seen them in WW II movies, where patriots in the Philippines or other South Pacific locations behind enemy lines would power a clandestine radio transmitter by pedaling on a bicycle/electric generator. Fast forward more than 60 years and such a machine is now part of something ...
Ventec: Thomas Michels to Speak at the EIPC Summer Conference
SUZHOU, CHINA - Ventec's European Managing Director Thomas Michels will speak at EIPC Summer Conference on June 1st & 2nd, 2017 to be held at the Best Western Plus Manor Hotel, Solihull, UK.
Indium Corporation’s Mackie to Present at IMAPS ATW on Advances in Semiconductor Packaging
CLINTON, NY - Indium Corporation’s
Andy C. Mackie, PhD, MSc
, Senior Product Manager for Semiconductor and Advanced Assembly Materials, will present at the
IMAPS Advanced Technology Workshop and Tabletop Exhibition on Advances in Semiconductor Packaging
on June 15 at Binghamton University in Vestal, N.Y.
Dr. Mike Bixenman Discusses Non-Standard Test Methods at ICSR
NASHVILLE, TN - KYZEN is pleased to announce that Mike Bixenman, DBA will present at the International Conference on Soldering & Reliability (ICSR) held in conjunction with the Toronto SMTA Expo & Tech Forum.
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