Wednesday, October 26, 2016
Publication Date: 05/1/2009
Archive >  May 2009 Issue >  Electronic Mfg. Products > 

Rogers Releases New Hi Freq Laminates
PC board laminates.
Rogers, CT — Rogers Corp.'s Advanced Circuit Materials Division's RO4000, RO2808 and ULTRALAM 3000 laminates provide proven solutions for a wide range of applications such as high-performance chip carrier substrate, high-speed network transport gear and high-speed data transmission used in high-speed computing,

telecommunications and wireless.

The recently launched RO2808 high frequency material. A ceramic-filled PTFE material with a dielectric constant of 7.6, RO2808 material offers the stability and high frequency performance of LTCC. The material has a low loss tangent of 0.002 or less, and can be supplied as 1-mil thick boards to support low profile designs. It also features high moisture resistance, high reliability and excellent high frequency performance.

RO4000 laminate is widely used in the power amplifier market, with outstanding electrical and mechanical properties. A low loss material, the laminate exhibits low z-axis expansion, making it an appropriate choice for high frequency applications in which plated through-hole reliability is important.

The company's ULTRALAM 3000 Series LCP circuit material is a thin double-clad copper laminate, characterized by low and stable dielectric constant (2.9) and dielectric loss. It has very low moisture absorption (<0.04 percent by weight). The laminates are used for high frequency microminiaturization applications, sensors, antennas and high-speed flip-chip designs. The laminate can be used with ULTRALAM 3908 bonding film for multilayer constructions.

Contact: Rogers Corporation, P.O. Box 188, Rogers, CT 06263-0188 860-774-9605 fax: 860-779-5509 Web:

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