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Thursday, October 27, 2016
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NEPCON South China '16
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Atlantic Design/ATX/MDM '16
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productronica,The ASSEMBLY Show, IMAPS, MDM/Minneapolis '15
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SEMICON West '14
NEPCON China, SMT/Hybrid Pkg, EDS, NWPTE '14
IPC APEX '14
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ATX Midwest, IMAPS, PCB West '13
ATX West '14
ATExpo & IPC MW 07
NEPCON China '13, EDS, more
SEMICON WEST/Intersolar '12
NEPCON China Product Preview '12
Atlantic Design/MDM 10
Electronics West/MDM 11
SEMICON WEST 10
Atlantic Design/MDM 11
ATLANTIC DESIGN & MFG '13
Atlantic Design/MDM 09
SEMICON WEST 08
NEPCON South China '13
ATExpo & IPC MW 08
Electronics West/MDM 08
NEPCON China Product Preview '13
Electronic West/MDM 09
SMTAI and productronica '13
Multi tradeshow Product Preview '12
AATE/IPC Midwest 10
Electronics West/MDM 12
ATE and IPC MW 09
SMTAI and productronica '13
Atlantic Design/MDM 08
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CeTaQ Intros Placement Force Measurement
Placement pressure verifier.
Bedford, NH — CeTaQ has developed an innovative measuring device that is able to exactly gauge the minute press-on force occurring during the automated component placement operation. A quick, straightforward analysis of the actual placement forces allows early identification of weak points in this process and, therefore, can avoid component damage.
Driven by ongoing miniaturization trends and the quest for efficient assembly of reliable electronic products, the monitoring of machine placement force applied to components is moving critically into the focus of the company's quality assurance departments.
The measuring device travels over the conveyor into the placement machine like a real PC board. Using an appropriate placement program, the user can place any desired component. The measurements take place under normal process conditions; this means that the machine operates the same way as it would in normal production. The data received are analyzed using a special software package. The output is realized as a statistical distribution list of the measured forces and also includes force-time sequences of single placement steps, which can be analyzed further.
The device provides verification of the placement forces under real production conditions, making it possible to use these results to optimize process parameters.
It will detect possible weak points, making it possible to eliminate root causes, and allows for minimization of defects caused by placement force overload.
As with all of the company's measurement applications, performance validation of placement (Z) force is offered as a service to its worldwide customer base. In addition to this new service offering, the measurement equipment itself can be purchased outright.
Contact: CeTaQ Americas, P.O. Box 7332, Nashua, NH 03060
603-883-7843 fax: 603-484-8478 E-mail: firstname.lastname@example.org Web:
See at APEX Booth #1683.
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