Save. Share. Connect.
Saturday, October 22, 2016
VOLUME - NUMBER
NEPCON South China '16
SEMICON West '16
Atlantic Design/ATX/MDM '16
NEPCON China,SMT/Hybrid Pkg,EDS,EWPTE '16
ATX/MDM West '16
productronica,The ASSEMBLY Show, IMAPS, MDM/Minneapolis '15
Nepcon South China '15
SEMICON West '15
ATX/MDM EAST '15
EDS, SMT/Hybrid Pkg,Wire Tech Expo '15
NEPCON China '15
ATX WEST/APEX '15
AATE and IPC MW 11
SMTAI, Autotest, ATX MW/MDM and Assembly '14
SEMICON West '13
Electronics West/MDM and IPC/APEX '13
SEMICON West '14
NEPCON China, SMT/Hybrid Pkg, EDS, NWPTE '14
IPC APEX '14
Electronics West/MDM 10
ATX Midwest, IMAPS, PCB West '13
ATX West '14
ATExpo & IPC MW 07
NEPCON China '13, EDS, more
SEMICON WEST/Intersolar '12
NEPCON China Product Preview '12
Atlantic Design/MDM 10
Electronics West/MDM 11
SEMICON WEST 10
Atlantic Design/MDM 11
ATLANTIC DESIGN & MFG '13
Atlantic Design/MDM 09
SEMICON WEST 08
NEPCON South China '13
ATExpo & IPC MW 08
Electronics West/MDM 08
NEPCON China Product Preview '13
Electronic West/MDM 09
SMTAI and productronica '13
Multi tradeshow Product Preview '12
AATE/IPC Midwest 10
Electronics West/MDM 12
ATE and IPC MW 09
SMTAI and productronica '13
Atlantic Design/MDM 08
Add Message Board
Omron Intros First Dual-Mode CT Scanner
Automated dual-mode CT X-ray system.
Schaumburg, IL — Omron is introducing a time-saving new X-ray inspection system — the VT-X series — that shortens the tact time for in-line, post-solder inspection of printed circuit boards. The VT-X is described as the world's first dual mode X-ray inspection system that combines highly accurate computed tomography (CT) scanning with high-speed "tomosynthesis" scanning to achieve production line speeds.
Use of CT technology eliminates the clutter from bottom-side parts while top-side parts are inspected. Because CT scanning technology alone can be quite slow, such that inspections must be done off-line or handled slowly in-line, the company's solution enables use of both technologies in the same inspection.
The VT-X shortens inspection time for 4 BGAs to 60 seconds, depending on specific board layout, by allowing the optimum mix of CT scanning for areas where components may be shadowed by bottom side components and fast "tomosynthesis" for inspections where bottom side components are not present.
The X-ray inspection system was designed to inspect ball grid arrays (BGA), Quad Flat Pack (QFP) heel or back fillets, components with gullwing and J-shape leads, and connectors on board sizes up to 10 x 13-in.
For a whole board inspection solution, a combination of AOI and X-ray inspections delivers the best results. The VT-X can be used with the company's Qup-Navi software to identify root cause of failure based on data mining of inspection results.
Contact: Omron Electronics LLC, 1 Commerce Drive, Schaumburg, IL 60173
866-886-6766 or 847-843-7900 fax: 847-843-8081 Web:
See at APEX Booth #1147.
© 2015 USTECH. All Rights Reserved. |
Contact Us: 610-783-6100 | email@example.com
powered by GIM