Save. Share. Connect.
Saturday, May 28, 2016
VOLUME -24 NUMBER 3
Publication Date: 03/1/2009
Front Page News
People in the News
Electronic Mfg. Services
Electronic Mfg. Products
Special Feature: PCB and Assembly
Product Preview: APEX
March 2009 Issue
Product Preview: APEX
Add Message Board
Koh Young Intros Solder Paste Inspection System
Solder paste inspection system.
Seoul, Korea — Koh Young Technology is unveiling its next generation solder paste inspection (SPI) and process optimization tool, the aSPIre-2 — developed to meet increasing demands for speed and accuracy from electronics manufacturers, and is presented as a significant process optimization tool. Using this tool, the customer will optimize the printing process and stop printing problems before they become soldering defects downstream — resulting in higher yields and throughput, less touch-up and rework.
According to the company, the new fully automated system builds on the capabilities and success of the popular aSPIre system, but is faster and delivers higher performance, offering more features and unique capabilities. The company states that it is the first and only SPI systems supplier to bring patented 3D inspection technology to the industry with aSPIre and its inspection systems.
The product is a fully automated in-line SPI system that delivers 100 percent 3D inspection of solder paste with a high level of speed and camera accuracy. Its powerful SPC Plus analytical tools and hardware combine to deliver a level of process optimization designed for high-throughput environments where best first-pass yields and zero defect manufacturing are required. Its powerful
hardware/software package reportedly delivers true, reliable data and SPC analysis at in-line speed, with no false calls and no escapes.
The system's performance capabilities include what is said to be the industry's highest processing speed — up to 50 percent faster; 4-axis projection for ultimate speed and accuracy; true patented 3D volume measurement; short programming time; greater configurability and flexibility; enhanced PC board warpage compensation; more powerful, full-featured SPC Plus and user interface; and no PC board color sensitivity.
Contact: Koh Young technologies Inc., F14, ACE Techno X, 470-5 Gasan-dong, Geumcheon-gu, Seoul, Korea (153-789)
82-2-6670-5000 fax: 82-2-6670-5001 E-mail: email@example.com Web:
See at APEX Booth #2525.
© 2015 USTECH. All Rights Reserved. |
Contact Us: 610-783-6100 | firstname.lastname@example.org
powered by GIM
You were trying to view a protected page.
Please login to gain access or cancel to go back to the site.
Remember User Name
Stay signed in.
Forgot your password?