-> Wafer-Level Packaging Conference Delivers During Tough Times

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VOLUME -23 NUMBER 12

Publication Date: 12/1/2008

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Archive > December 2008 Issue > Hi-Tech Events >


	Wafer-Level Packaging Conference Delivers During Tough Times

	San Jose, CA — The 5th Annual International Wafer-Level Packaging Conference ended 2008 with success, bringing in its highest attendance yet. The four-day program began with two-days of half-day tutorials on topics ranging from IC Packaging to Failure Modes & Analysis of Flip-Chip Assemblies given by leading instructors in the industry. The conference line-up opened with the popular Business and Marketing Panel Discussion, featuring panelists Jan Vardaman, TechSearch International; Jim Walker, Gartner/Dataquest; Dr. Eric Mounier; Yole Developpement, and Dan Tracy, SEMI. The day closed with a keynote presentation from Dr. Thomas H. Di Stefano of Centipede Systems on "Wafer-Level Packaging: The Promise Evolves." A new panel topic for 2008, "Where in the World?", included expert panelists who addressed the risks and rewards of establishing a semiconductor-related business in locations that include China, India, Mexico and Vietnam. The IWLPC featured 50 tabletop exhibit displays and over 40 technical presentations. Over 400 attendees came from 19 countries, including Austria, China, Finland, France, Germany, Hong Kong, Israel, Japan, Liechtenstein, Malaysia, Morocco, Norway, Republic of Korea, Singapore, Sweden, Switzerland, Taiwan, United Kingdom and the United States. Contact: SMTA, 5200 Willson Rd., Suite 215, Edina, MN 55424 952-920-7682 fax: 952-926-1819 Web: http://www.smta.org