Save. Share. Connect.
Thursday, May 26, 2016
VOLUME -23 NUMBER 12
Publication Date: 12/1/2008
Front Page News
People in the News
Electronic Mfg. Services
Electronic Mfg. Products
Special Feature: Test and Measurement
Product Preview: Electronic West / MDM
December 2008 Issue
Add Message Board
Nextreme Thermoelectrics Now Lead-Free
Lead-free TEs use gold/tin.
Durham, NC — Nextreme Thermal Solutions has developed non-lead-based solder processes for use in the manufacturing of its thin-film thermoelectric product line. This development means that announced that all future thermoelectric products will be manufactured using RoHS-compliant assembly methods.
As the replacement for lead-based solder, the company is using a Gold/Tin (AuSn) alloy. AuSn solder provides excellent joint strength and thermal conductivity. With a melting point of 278°C, AuSn enables the use of standard processes for the integration of the company's devices into photonic, microelectronic and optoelectronic device packages, such as laser diodes, semiconductor optical amplifiers and sensors, and to operate at higher temperatures. The company's thin-film thermoelectric products are manufactured in volume with the Copper Pillar Bump process, an established electronic packaging approach that scales well into large arrays. The process integrates thin-film thermoelectric material into the solder bumped interconnects that provide mechanical and electrical connections for today's high-performance, high-density ICs.
Contact: Nextreme Thermal Solutions, Inc., 3908 Patriot Dr., Suite 140, Durham, NC 27703-8031
919-597-7348 fax: 919-597-7300 E-mail: firstname.lastname@example.org Web:
© 2015 USTECH. All Rights Reserved. |
Contact Us: 610-783-6100 | email@example.com
powered by GIM