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Thursday, March 30, 2017
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Electronic Mfg. Products
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Auto-Dip Solder System from Manncorp
Auto-dip solder system.
Willow Grove, PA — A new lead-free solder dipping system is reportedly finding wide acceptance among PC board through-hole assemblers requiring a higher-throughput mass soldering capability than labor-intensive hand methods. "Auto-Dip," is a bench-top fixtureless system that simulates the action of a wave system without the possibility of dislodging components.
Boards of any shape, retained by a grid of needle supports, are dipped into the solder bath; solder is then evenly applied while surface tension "floats" the PC boards at correct through-hole wetting height. Single boards or pallets of up to 19.3 x 12.5-in. (490 x 320mm) are processed in just 2 to 12 seconds.
According to the company, Auto-Dip is much faster than manual soldiering — especially for round or odd-shaped boards that are processed without fixtures.
Activation is microprocessor-controlled with startup and shutdown times presettable for intervals of up to one-week. Adjustments also exist for dwell time, lead-free compatible temperatures from 220 to 299°C, and dipping angle. A built-in motorized skimmer removes dross as needed.
Contact: Manncorp, 2845 Terwood Rd., Willow Grove, PA 19090
800-745-6266 or 215-830-1200 fax: 215-830-1206 E-mail: Sales@manncorp.com Web:
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