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Publication Date: 10/1/2008
Archive >  October 2008 Issue >  Hi-Tech Events > 

IPC & JEDEC: Lead-Free Conference
Arlington, VA — IPC and JEDEC Solid State Technology Association are jointly sponsoring an International Conference on Lead-Free Electronics. The Conference is to be held December 8-10, 2008 at the Fairmont Hotel in Dallas, Texas. The event will feature a full-day technical conference with an outstanding roster of speakers, as well as two full days of informative half-day workshops.

"The electronics industry is in the midst of one of the largest changes that has occurred over the last 50 years. The migration to lead-free materials has resulted in a significant shift in the way the industry perceives reliability. It is critical for engineers and technical managers to stay informed of latest developments with respect to performance of lead-free assemblies," said David Torp, IPC vice president of standards and technology.

Added John Kelly, president of JEDEC, "This joint conference hosted by IPC and JEDEC provides the most comprehensive and up-to-date compendium of information presented on this topic. As member-driven organizations, we believe it's imperative to give the industry as many opportunities as possible to share real-world information on how companies are meeting these challenges every day."

The technical conference program features speakers from many well-known companies, including Alcatel-Lucent, Dell, Emerson and Texas Instruments. Selected topics : RoHS Challenges on Electronic Assembly and Material, Transitioning Server Motherboards to Lead-Free, Characterization of the Thermal Stability of Electrical Laminates for Lead-Free Soldering, XRF Verification of Component Terminations, RoHS Compliant Components in a Non-RoHS Process, Lead-Free Solder Joint Reliability, PLM Solutions to Accelerate Lead-Free Electronics Designs, A Component Supplier's Green Approach.

Those searching for information on reliability will find it covered from many angles in the half-day courses. Courses include: Lead-Free Solder Process { } Survival, Quality, and Reliability: The Problems, Lead-Free Solder Process { } Survival, Quality, and Reliability: The Solutions, Final Finishes and their Compatibility with Lead-Free Soldering, Data Management for Eco-Compliance, Lead-Free Reliability for Harsh Environment Electronics, Understanding Failure and Root-Cause Analysis in Lead-Free Electronics, Lead-Free Components, Understanding of J-STD-020 and J-STD-033{ } The impact of PB-Free on Classification and Handling of Moisture-Sensitive ICs.

Top suppliers will also be showcasing new products and services in a tabletop exhibit space.

Contact: IPC 847-597-2826 Web: or

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