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Publication Date: 10/1/2008
Archive >  October 2008 Issue >  Hi-Tech Events > 

IEEE Globecom 2008 Slated for New Orleans
New York, NY — The IEEE Communications Society (ComSoc), the leading worldwide professional organization dedicated to the advancement of communications technologies, will host its annual flagship IEEE Globecom event at the Hilton New Orleans Riverside Hotel from November 30-December 4. Themed "Building A Better World Through Communications," the event is expected to bring together more than 2,500 academia, engineers, designers, developers and industry professionals.

In addition to hundreds of symposia, technical sessions, workshops and tutorials as well as a special session dedicated to the History of Telecommunications, this year's event will be held in conjunction with the 3rd Annual IEEE Communications Industry Forum, which includes the Design & Developers Forum. Other prominent events co-located with IEEE Globecom 2008 will be the World Telecommunications Congress (WTC) as well as EntNet 2008, a long-running event organized by the IEEE to promote the development and evolution of enterprise-level networking technologies.

IEEE Globecom 2008 will officially commence on Sunday, November 30 with numerous tutorials and workshops dedicated to topics such as "Near-Capacity Wireless Multimedia Communications," "Wireless Telemedicine" and "Web Security." In all, 22 tutorials and nine workshops exploring topics ranging from WIMAX advanced broadband wireless systems to wireless mesh and senor networks will be held on Sunday, November 30 and Thursday, December 4.

Starting on Monday, December 1, leading industry experts will also address attendees on numerous key telecommunications topics. These keynote speakers include Kaoru Yano, president of the NEC Corporation; Dr. Flavio Bonomi, head of Cisco Research; John Donovan, chief technology officer at AT&T; and Richard J. Lynch, executive vice president & chief technology officer at Verizon Communications.

Another highlight includes a special session on the History of Telecommunications, which will begin with a tutorial on The History of OFDM and culminate with a panel discussion on the invention of radio and the history of the events involved with creating the modern communications world. The conference's extensive technical program encompassing more than 150 sessions will also begin on December 1 and extend through December 3.

In addition there will be the 3rd Annual IEEE Communications Industry Forum & Expo, which will be held from December 1 to 3. During the course of the conference, visitors will have the opportunity to tour the Expo exhibit hall and learn about the latest telecommunications solutions currently under development and being introduced by leading companies such as Telecordia Technologies, NEC, NIKSUN, OPNET Technologies and others.

Included within the Expo will be the Design & Developers Forum, which will offer 20 sessions from Monday, December 1 to Wednesday, December 3 dedicated to cutting-edge topics such as "Wireless Access for Vehicular Environments," "B3G & 4G Mobile Wireless Broadband Technologies" and "Security for Seamless Mobility."

Other key events held concurrently with IEEE Globecom 2008 are the IEEE International Conference on Enterprise Networking and Services (EntNet) 2008. This event will host several panel discussions under the theme of "Enterprise Solutions for Business Continuity and Disaster Recovery Planning" on December 3.

The World Telecommunications Congress (WTC), which is also co-located, will dedicate 12 sessions to areas ranging from next generation mobile networks to packet/optical network infrastructures on December 1 and 2.

Another key event expected to attract a great deal of attendee interest will be the Gold Session titled "The Road to the Future." On December 3, a panel of scholars, researchers, business leaders and academia will discuss issues of special interest to industry professionals currently in the early stages of career planning.

Contact: IEEE Communications Society, 3 Park Avenue, New York, NY 10016 212-705-8938 E-mail: Web:

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