Monday, October 23, 2017
VOLUME -23 NUMBER 10
Publication Date: 10/1/2008
Advertisements

Archive >  October 2008 Issue >  Front Page News > 
At Last, An Electric Car that Really Works!


Mountain View, CA — Is there an electric car in your future? Chances are very good, especially if a new joint venture succeeds in bringing a Norwegian electric called the "Th!nk City" to the U.S. in large quantities. There are plenty of other electrics vying for American...
Read More
Gold Nanostructures Catalyze Everything

Gaithersburg, MD — For most of us, gold is only valuable if we possess it in large-sized pieces. However, the "bigger is better" rule isn't the case for those interested in exploiting gold's exceptional ability to catalyze a wide variety of chemical reactions, including the oxidation of poisonous carbon monoxide ...Read More
First-Ever Power Conversion Standard IPC-9592

Bannockburn, IL — IPC — Association Connecting Electronics Industries® has published the first-ever power conversion standard, IPC-9592, Requirements for Power Conversion Devices for the Computer and Telecommunications Industries. The 75-page specification covers the complete range of power conversion ...Read More


 
 
European Space Agency approval for Ventec material in Amphenol Invotec rigid & flex-rigid production

Amphenol Invotec, one of Europe’s leading manufacturers of complex printed circuit boards (PCBs), and Ventec International, a world leader in the production of polyimide & high reliability epoxy laminates and prepregs, are delighted to announce that Ventec's VT-901 polyimide material is now fully qualified by ESA in Amphenol Invotec’s manufacturing process for rigid and Flex-rigid PCBs.


New Dry Film Negative Photoresist for MEMS and Wafer-Level Packaging

DELAWARE, OH Engineered Material Systems, Inc., a leading global supplier of negative photo resist materials for MEMS and TSV passivation/sealing applications, is pleased to introduce the DF-2005 dry-film negative photo resist for use in micro-electro mechanical systems (MEMS), wafer-level packaging and CMOS applications (metallization). This material formulation has been optimized for hot roll lamination and processing on MEMS and IC wafers.


 
search login