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Tuesday, September 27, 2016
VOLUME -23 NUMBER 9
Publication Date: 09/1/2008
Front Page News
People in the News
Electronic Mfg. Services
Electronic Mfg. Products
Special Feature: PCB and Assembly
Product Preview: ATExpo/IPC-MW
September 2008 Issue
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Laird Intros Thermally Conductive Gap Filler
Thermal gap filler.
St. Louis, MO — Laird Technologies, Inc. has launched its T-flex
700 for use as a thermal interface material (TIM). This new material is described as the next generation thermal pad in the T-flex gap filler line. It improves the thermal performance of the T-flex line by increasing the thermal conductivity to 5.0 W/mK.
The soft material is highly compliant, allowing for thinner interfaces and overall improved thermal performance as measured by total thermal resistance. High compliancy accommodates applications where the tolerance stack-up is high and the maximum mechanical stress on the components must be low. A low shore OO hardness value of 50 helps maintain device reliability when mechanical shock and vibration are important design considerations. The T-flex 700 is naturally adhesive for ease of handling and assembly.
Thickness ranges currently available include 0.040 to 0.200-in. (1mm to 5mm) in 0.010-in. (0.25mm) increments. The product is available in standard sheets or die cut parts that can be custom made to specification. Another available option is adhesive on only one side. The materials are RoHS-compliant.
The material is a high-performance solution available to mechanical design engineers working on a wide range of electronic devices including notebook and desktop computers, servers, wireless base stations and radio heads, laptops, LED lighting, set top boxes, LCD and PDP televisions, automotive electronics, and general applications employing heat pipes, heat sinks or thermal modules.
Contact: Laird Technologies, Inc., 16401 Swingley Ridge Rd, Ste.700,Chesterfield, MO 63017
866-928-8181 or 636-898-6000 fax: 636-898-6100 E-mail: firstname.lastname@example.org Web:
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