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Publication Date: 09/1/2008
Archive >  September 2008 Issue >  Product Preview: ATExpo/IPC-MW > 

SPEA: Integrated Test Cells for MEMS
Integrated MEMS testing system.
Volpiano, Italy — SPEA has introduced its new, comprehensive hardware and software test cell solution for the multi-site test of MEMS and sensors. Single-vendor test cells that integrate test and handling, with true test capability of 32 devices in parallel, are an answer to the relentless pressure to drastically reduce the cost of the wafer and final test of MEMS.

The complete integration between modular test equipment and handler provides a turnkey solution in a minimized footprint, while taking advantage of a unique software environment and an optimized communication between the systems. Specific sensor stimulus modules are added to the handler to meet specific sensor device

requirements: MEMS gyroscopes, 3-axial accelerometers, microphones, pressure sensors, and magnetic sensors.

The H3500 high-throughput handlers are designed for volume testing of up to 13,000 devices per hour. The handling is fully automated from the input tray to the output tray (at the end of the test), by using a fast, pick-and-place test module based on XY mechanism with linear motors and magnetic bearings. The frictionless movement of the high-speed axis, with 2 heads with 8/16 pick-ups each, guarantees reliability, extreme accuracy and no damage during touchdowns.

The modular system allows fast set-up and changeover, with easy head and pickup replacement and kits for different device packages — PLCC, QFP, TSSOP, QFN, BGA, µBGA, LGA, custom — from 2 x 2 to 40 x 40mm size.

With PerPin instrumentation, 88 universal slots, up to 2,048 channels, the systems can perform the parametric and functional test of cost-sensitive as well as complex and sophisticated systems-on-a-chip (SoCs), systems in package (SiP), MEMS and power devices, including the parallel multi-site testing of multiple devices. The test head universal slots can be equipped with a range of instruments: digitizers, arbitrary waveform generators, counters, analog and digital channels, and low power generators.

Sensor Stimulus Units allow the parallel functional test of MEMS and sensors. The series includes the units for applying and measuring all the physical stimuli required for testing MEMS devices, including 3-axial accelerometers, gyroscopes, pressure sensors, magnetic sensors, microphones, and customized applications.

Contact: SPEA America, 2609 S SW Loop 323, Tyler, TX 75701 903-595-4433 fax: 903-595-5003 E-mail: Web:

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