Save. Share. Connect.
Sunday, January 22, 2017
VOLUME -23 NUMBER 9
Publication Date: 09/1/2008
Front Page News
People in the News
Electronic Mfg. Services
Electronic Mfg. Products
Special Feature: PCB and Assembly
Product Preview: ATExpo/IPC-MW
September 2008 Issue
Add Message Board
IPC Int'l Test & Inspection Conference
Bannockburn, IL — IPC's International Test and Inspection Technology Conference: "Reducing Time to Market", will take place November 10-12, 2008 at the Embassy Suites Hotel in Santa Clara, California. Product verification has grown more complex than ever before and test methodologies have become a collaborative activity between the end customer and the assembler. IPC has developed a three-day test and inspection conference to address these needs.
All levels of the supply chain have concerns about cycle time, cost reduction and providing high-quality products to the next "runner" in the supply chain relay. Kicking off the event on the afternoon of November 10, a half-day workshop, "Future of Test and Inspection Protocols," will be held. Workshop leaders will explore test and inspection alternatives, consider cost implications and incorporate all associated technologies for test and inspection.
Workshop presenter and IPC director of technology transfer, Dieter Bergman, explains, "The conference will examine the methods and practices currently used to validate the performance capability of electronic equipment. Attendees will explore different testing methods and strategies that verify the sum and quality of the parts used in the assembly process — electronic components, base materials, printed boards, application-specific subassemblies and more."
Adds Micheala Brody, cofounder of Zero Defects and program committee member, "Time is money. Rules have changed and test methodologies have become a collaborative activity between the end customer and the assembler. Manufacturing and test engineers from OEM to EMS companies looking for a thorough review of product verification — through testing and inspection — at each level of the manufacturing process must attend this conference."
On November 11, sessions will cover supply-chain testing, including electronic components, materials, printed boards, and assembly test and inspection methodologies. The day will end with a closing keynote on customer expectations for the future of testing provided by a panel of OEM (original equipment manufacturer) representatives. November 12 will begin with an opening keynote on variation in testing strategies. Conference speakers will address: test fixtures; boundary scan planning; MDA, ICT, and functional testing; automated optical inspection and automated X-ray inspection; environmental stress screening and ultrasound testing. Concluding with vendor presentations, the entire conference will allow participants to explore the changing world of test protocols — and reduce their time to market.
Contact: Anne Marie Mulvihill,
847-597-2827 E-mail: AnneMarieMulvihill@ipc.org Web:
© 2015 USTECH. All Rights Reserved. |
Contact Us: 610-783-6100 | firstname.lastname@example.org
powered by GIM