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Wednesday, September 28, 2016
VOLUME -23 NUMBER 9
Publication Date: 09/1/2008
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Electronic Mfg. Services
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Special Feature: PCB and Assembly
Product Preview: ATExpo/IPC-MW
September 2008 Issue
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Technology from DEK Earns Advanced Packaging Award
Flemington, NJ — DEK's latest advance, VectorGuard Platinum, introduced at Semicon West has earned a prized Advanced Packaging Award. Pushing beyond the limits of conventional stencil technology, VectorGuard Platinum draws on micro-stencil, electroformed fabrication techniques to deliver stencils capable of addressing the challenges of advanced packaging applications that require unprecedented aperture and web spacing dimensions.
Enabling extremely fine geometries and exceptionally high yields, VectorGuard Platinum technology successfully meets the demands of ball grid arrays direct chip attach, flip chip and wafer-level applications.
With a MEMS-based fabrication process as its core, the precision of VectorGuard Platinum enables apertures of 20µm on 50µm pitch, while also delivering outstanding thickness uniformity. The unique manufacturing process of the Platinum foils guarantees exceptionally smooth sidewalls for extremely efficient paste transfer, which is essential for high-yield, ultra fine pitch advanced packaging applications. Other characteristics and benefits of VectorGuard Platinum stencils include low internal stress and high hardness to eliminate stencil deformation, and superior control of surface roughness to ensure accuracy, uniformity, quality and tightly controlled deposits for both pastes and adhesives.
Contact: DEK, 8 Bartles Corner Rd., Flemington, NJ 08822
908-782-4140 fax: 908-782-4774 Web:
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