Monday, April 23, 2018
VOLUME -23 NUMBER 9
Publication Date: 09/1/2008
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Archive >  September 2008 Issue >  Front Page News > 
Wind Farms Proliferating Worldwide


Wind farms, one of the most viable candidates to replace parts of our oil-dependent technologies, are growing in numbers in the U.S., and have the potential to become more efficient than they are today. One of the newest is a modest farm of five 1.5 megawatt wind turbines located in Atlantic ...
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New 2-Pin JTAG Standard Coming

Houston, TX — As chips add new functionality and system designs evolve away from boards and toward multi-chip system-on-chip (SoC) architectures, developers of handheld and consumer electronics are faced with stricter pin and package constraints. Texas Instruments, Inc. (TI) (NYSE: TXN), a key member of the IEEE ...Read More
2011: The Year of the OLED


Will 2011 be the year of the OLED? Recent announcements from major developers of organic electroluminescence (OLED) technology seem to indicate that 2011 will be the year that the first commercial OLED lighting applications will appear on the market. Prototypes have been demonstrated by several companies ...
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SMTA Europe's Harsh Environments Conference Session 7 to Focus on Hi-Temp Mats/Fab
SMTA Europe announces Session 7 Technical Program on High Temperature PCB Materials and Fabrication at the “Electronics in Harsh Environments Conference” to be held in Amsterdam, Netherlands, on April 25th, 2018.      
EOS WLC550 series offers maximum Cooling Flexibility on Standard Footprint
Last week at the MT-CONNECT in Nuremberg more than 150 companies from the European MedTec Business met for discussing the latest trends and guidelines in MedTec industry. When EOS power presented its medical up to class-2 powersupplies at MT-CONNECT, the EOS team made an exciting observation: While everyone is still talking about the size of the powersupplies, which is still very true for home devices, the real crucial factor for sales support for larger devices at the MT connect was the cooling.   
SEMI and TechSearch International Report Global Semiconductor Packaging Materials Market Reaches $16.7 Billion

MILPITAS, CA SEMI, the industry association representing the global electronics manufacturing supply chain, and TechSearch International today reported that the global semiconductor packaging materials market reached $16.7 billion in 2017. While slower growth of smartphones and personal computers – the industry’s traditional drivers – is reducing material consumption, the slowdown was offset by strong unit growth in the cryptocurrency market in 2017 and early 2018. Flip chip package shipments into the cryptocurrency market, while providing a windfall to many suppliers, are not expected to remain at high levels.  


C&K ANNOUNCES THAT IT HAS ACQUIRED VUILLERMOZ
Newton, MA – C&K, one of the world’s most trusted brands of high-quality electromechanical switches, today announces that it has acquired the company Vuillermoz, a micro-mechanical components and tooling company located in St. Claude, France.



 
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