Tuesday, October 24, 2017
VOLUME -23 NUMBER 9
Publication Date: 09/1/2008
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Archive >  September 2008 Issue >  Front Page News > 
Wind Farms Proliferating Worldwide


Wind farms, one of the most viable candidates to replace parts of our oil-dependent technologies, are growing in numbers in the U.S., and have the potential to become more efficient than they are today. One of the newest is a modest farm of five 1.5 megawatt wind turbines located in Atlantic ...
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New 2-Pin JTAG Standard Coming

Houston, TX — As chips add new functionality and system designs evolve away from boards and toward multi-chip system-on-chip (SoC) architectures, developers of handheld and consumer electronics are faced with stricter pin and package constraints. Texas Instruments, Inc. (TI) (NYSE: TXN), a key member of the IEEE ...Read More
2011: The Year of the OLED


Will 2011 be the year of the OLED? Recent announcements from major developers of organic electroluminescence (OLED) technology seem to indicate that 2011 will be the year that the first commercial OLED lighting applications will appear on the market. Prototypes have been demonstrated by several companies ...
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European Space Agency approval for Ventec material in Amphenol Invotec rigid & flex-rigid production

Amphenol Invotec, one of Europe’s leading manufacturers of complex printed circuit boards (PCBs), and Ventec International, a world leader in the production of polyimide & high reliability epoxy laminates and prepregs, are delighted to announce that Ventec's VT-901 polyimide material is now fully qualified by ESA in Amphenol Invotec’s manufacturing process for rigid and Flex-rigid PCBs.


New Dry Film Negative Photoresist for MEMS and Wafer-Level Packaging

DELAWARE, OH Engineered Material Systems, Inc., a leading global supplier of negative photo resist materials for MEMS and TSV passivation/sealing applications, is pleased to introduce the DF-2005 dry-film negative photo resist for use in micro-electro mechanical systems (MEMS), wafer-level packaging and CMOS applications (metallization). This material formulation has been optimized for hot roll lamination and processing on MEMS and IC wafers.


 
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