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Monday, December 5, 2016
VOLUME -23 NUMBER 9
Publication Date: 09/1/2008
Front Page News
People in the News
Electronic Mfg. Services
Electronic Mfg. Products
Special Feature: PCB and Assembly
Product Preview: ATExpo/IPC-MW
September 2008 Issue
Front Page News
Wind Farms Proliferating Worldwide
By Tom Adams
Wind farms, one of the most viable candidates to replace parts of our oil-dependent technologies, are growing in numbers in the U.S., and have the potential to become more efficient than they are today. One of the newest is a modest farm of five 1.5 megawatt wind turbines located in Atlantic ...
New 2-Pin JTAG Standard Coming
Houston, TX — As chips add new functionality and system designs evolve away from boards and toward multi-chip system-on-chip (SoC) architectures, developers of handheld and consumer electronics are faced with stricter pin and package constraints. Texas Instruments, Inc. (TI) (NYSE: TXN), a key member of the IEEE ...
2011: The Year of the OLED
By Harry Zervos, Technical Consultant, IDTechEx
Will 2011 be the year of the OLED? Recent announcements from major developers of organic electroluminescence (OLED) technology seem to indicate that 2011 will be the year that the first commercial OLED lighting applications will appear on the market. Prototypes have been demonstrated by several companies ...
Murphy, Choh and Pilla Join ClassOne Technology's Board of Advisors
KALISPELL, MT - ClassOne Technology (
), manufacturer of advanced wet processing equipment for ≤200mm substrates announced the formation of a Board of Advisors. This body will be made up of highly-regarded senior executives from the semiconductor industry who will provide their perspective and guidance to ClassOne as it navigates the expansion of its operations.
Indium Corporation’s Karch Recognized for Best Presentation at IMAPS Autumn Conference 2016
CLINTON, NY - Indium Corporation’s
, Regional Technical Manager for Germany, Austria and Switzerland, was recognized for his technical presentation at the IMAPS Autumn Conference in October in Munich, Germany.
Karch was awarded “Best Presentation” for the session New Solder Material Technology in the Manufacturing Process of IGBT Modules, which discussed a new method that produces strong, reliable solder joints that resist cracking and thermal fatigue.
Ventec International Group Focus On High Thermal Performance Materials for Automotive and LED Applications at HKPCA 2016, China
SUZHOU, CHINA - Ventec International Group, a world leader in the production of polyimide & high reliability epoxy laminates and prepregs, will exhibit in
, scheduled to take place
December 7th-9th, 2016
Shenzhen Convention & Exhibition Center, China
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