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Tuesday, June 28, 2016
VOLUME -23 NUMBER 9
Publication Date: 09/1/2008
Front Page News
People in the News
Electronic Mfg. Services
Electronic Mfg. Products
Special Feature: PCB and Assembly
Product Preview: ATExpo/IPC-MW
September 2008 Issue
Front Page News
Wind Farms Proliferating Worldwide
By Tom Adams
Wind farms, one of the most viable candidates to replace parts of our oil-dependent technologies, are growing in numbers in the U.S., and have the potential to become more efficient than they are today. One of the newest is a modest farm of five 1.5 megawatt wind turbines located in Atlantic ...
New 2-Pin JTAG Standard Coming
Houston, TX — As chips add new functionality and system designs evolve away from boards and toward multi-chip system-on-chip (SoC) architectures, developers of handheld and consumer electronics are faced with stricter pin and package constraints. Texas Instruments, Inc. (TI) (NYSE: TXN), a key member of the IEEE ...
2011: The Year of the OLED
By Harry Zervos, Technical Consultant, IDTechEx
Will 2011 be the year of the OLED? Recent announcements from major developers of organic electroluminescence (OLED) technology seem to indicate that 2011 will be the year that the first commercial OLED lighting applications will appear on the market. Prototypes have been demonstrated by several companies ...
IPC Delivers the First Automotive Standard on Performance Requirements for Rigid Printed Boards
BANNOCKBURN, IL - In September of 2015, IPC delivered revision D of IPC-6012, Qualification and Performance Specification for Rigid Printed Boards. Building on this base standard, IPC has developed the first automotive addendum, IPC-6012DA, Automotive Applications Addendum to IPC-6012D Qualification and Performance Specification for Rigid Printed Boards.
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