Save. Share. Connect.
Sunday, August 20, 2017
VOLUME -23 NUMBER 8
Publication Date: 08/1/2008
Front Page News
People in the News
Electronic Mfg. Services
Electronic Mfg. Products
Special Feature: Test and Measurement
Product Preview: ATExpo/IPC-MW
August 2008 Issue
Add Message Board
Samtec Expands Edge Rate Interconnects
Edge Rate connectors.
New Albany, IN — Samtec has expanded its line of Board-to-Board and Cable-to-Board solutions using its rugged Edge Rate contact. These systems are designed for applications where signal integrity and durability are critical. The specially designed contacts provide superior impedance matching, reduced broadside coupling and crosstalk, and high cycle life.
Board level systems include the robust 0,8mm (0.0315-in.) pitch Edge Rate interconnect strip system (ERM8/ERF8 Series) and the high-speed RiseUp
MicroCard stacking system (RU8 Series). SEARAY
Open Pin Field Arrays (SEAM/SEAF Series) and DP Array
Differential Pair Arrays (DPAM/DPAF Series) offer high density solutions with maximum grounding and routing flexibility.
Cable-to-Board systems include the signal integrity optimized 0,8mm (0.0315-in.) pitch, 50Ω micro coax Edge Rate strip (ERCDA Series) and 100Ω Twinax Data Bank high speed/high density systems (GCCA/GCAM Series), as well as the 100Ω Twinax MicroCard assembly (EEDP Series).
Contact: Samtec, Inc., P.O. Box 1147, New Albany, IN 47151-1147
800-726-8329 or 812-944-6733 fax: 812-948-5047 E-mail: email@example.com Web:
© 2015 USTECH. All Rights Reserved. |
Contact Us: 610-783-6100 | firstname.lastname@example.org
powered by GIM