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Tuesday, May 23, 2017
VOLUME -23 NUMBER 8
Publication Date: 08/1/2008
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Electronic Mfg. Services
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Special Feature: Test and Measurement
Product Preview: ATExpo/IPC-MW
August 2008 Issue
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Ironwood Intros Multi-Layer Socket
Multi-layer processor socket.
Burnsville, MN — Ironwood Electronics has introduced a new high performance socket for processors with a POP memory socketed on top. The SG-BGA-7116 socket is made for socketing a 0.4mm BGA IC, 12 X 12mm body with 28 X 28 ball array to the target PC board and then an addition socket for a POP memory on top.
The POP memory on top has 12 x 12mm, 0.5mm pitch, 23 x 23 array) and Samsung 12 x 12mm 168-ball fine pitch ball grid array package. The contactors are designed for a 12mm package size, operating at bandwidths up to 40GHz with less than 1dB of insertion loss. The socket is designed to dissipate several watts without extra heat sinking and can handle even more with a custom heat sink. The contact resistance is typically 100 milliohms per pin. Installation is quick and easy by first attaching the socket to the PC board, inserting first IC into the stack, inserting the second contactor and IC, and tightening compression mechanism.
The SG-BGA-7116 is constructed with high performance and low inductance elastomer on both socketing levels with a gold plated, barbed pad connecting to the IC Pad. The temperature range is -40 to +100°C. The pin self-inductance is 0.11nH and mutual inductance is 0.028nH. Capacitance to ground is 0.028pF, and current capacity is 5amps per pin.
Contact: Ironwood Electronics, Inc., 11351 Rupp Dr.,Suite 400, Burnsville, MN 55337
800-404-0204 or 952-229-8200 fax: 651-452-8400 E-mail: email@example.com Web:
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