Tuesday, July 26, 2016
VOLUME -23 NUMBER 8
Publication Date: 08/1/2008
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ARCHIVE >  August 2008 Issue >  Front Page News > 
New Iron-Based Superconductors

Gaithersburg, MD — Researchers working at the National Institute of Standards and Technology (NIST) have discovered that a new class of iron-based superconductors discovered earlier this year shares similar unusual magnetic properties with previously known high-temperature superconductors based on ...

Microsoft to issue debt, buy back $40B in stock
Jessica Mintz, AP

Jessica Mintz, AP
SEATTLE - Chaos in the money markets gave Microsoft Corp. an opening Monday to announce it would take on debt for the first time, launch a new $40 billion stock buyback plan and raise its dividend.



 
 
Registration Open with New Exhibition Features at SEMICON Europa
GRENOBLE, FRANCE - Today SEMI announced registration opened for Europe’s largest electronics manufacturing exhibition, SEMICON Europa (25-26 October) in Grenoble. Featuring over 100 hours of technical sessions and presentations, SEMICON Europa includes semiconductor equipment and materials as well as additional topics, such as Imaging, Power Electronics, and Advanced Packaging.
SMTA and IPC: Cleaning and Conformal Coating Conference Program Finalized
MINNEAPOLIS, MN - The SMTA and IPC are pleased to announce the program for the 2016 Cleaning and Conformal Coating Conference being held October 25-27, 2016 in Rosemont, IL.

Two tutorials will be held on Tuesday, October 25th. Dale Lee, Plexus Corporation, will instruct “Design for Excellence: Focus on DfR-Design for Reliability of Hardware to be Cleaned” on Tuesday morning. After lunch, Doug Pauls, Rockwell Collins and Jason Keeping, P.Eng., Celestica, Inc. will co-instruct a course on “Robust Coating Processes in the Factory: Methods, Critical Parameters, Problems and Remedies.”

Viribright Lighting Announces US Patent Award for LED Packaging Design
CORONA, CA - Viribright Lighting, Inc., a global leader in LED lighting manufacturing, announced today that is has received a US Patent (US 9,379,300) for the design of an LED chip welded in a flip-chip manner on a floating copper heat radiation support. The Viribright LED packaging design generates more lumens per watt with better control of heat dissipation than previous LED manufacturing methods.

 
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