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Fujipoly: Thermal Interface Material Thermal interface material. Carteret, NJ — Fujipoly America Corp. now offers a uniquely formulated thermal interface material that can also help reduce EMI emissions. The new Sarcon® GR-c material exhibits 20dB of shielding effectiveness between 10MHz and 1GHz while providing a thermal conductivity of 1.2 W/m°K. In addition, the material maintains a low thermal resistance that ranges between 1.24 and 3.27°C/-in.2/W depending on thickness. The new material easily fills uneven surfaces that exist between electronic components and nearby heatsinks. This provides for complete, reliable thermal transfer. This gap filler formulation is available in sheets with thicknesses from 1.0 to 3.0mm up to a maximum 200 x 300mm dimension. Contact: Fujipoly America Corporation, P.O. Box 119, Carteret, NJ 07008 732-969-0100 fax: 732-969-3311 E-mail: info@fujipoly.com Web: http://www.fujipoly.com