-> Henkel Releases Epoxy Flux and Underfill

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Tuesday, September 27, 2016

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	Henkel Releases Epoxy Flux and Underfill

	Irvine, CA — Henkel's breakthrough epoxy flux material, Hysol FF6000, combines flux functionality and underfill protection into a single material. A reflow curable material, Hysol FF6000 has been formulated to provide fluxing action for lead-free solder joint formation and, when cured, delivers underfill-like protection against mechanical stress. The versatility of the material allows for various deposition methods including screen printing, dispensing, dipping and jetting. In addition, the material delivers broad application options that offer an in-line, cost-effective alternative for such processes as ball attach, Package on Package (POP) assembly, flip chip device and large format BGA and CSP assembly. Contact: Henkel Corp., 15350 Barranca Parkway, Irvine, CA 92618 949-789-2500 E-mail: doug.dixon@us.henkel.com Web: http://www.henkel.com/electronics See at Semicon West Booth #8311.