Monday, June 26, 2017
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Datacon Intros Multi Flip Chip Bonder

Trevose, PA — Datacon is introducing its 8800 CHAMEO Multi Flip Chip Bonder for high-volume, high-throughput MCM/SiP assembly. The product continues and extends the proven track record of its predecessor, the 8800 FC Quantum. The new 8800 CHAMEO is based on the same high-precision, dual-head architecture ...
 
 
 
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