HOMECURRENT ISSUEARCHIVETech XchangeABOUT USSUBSCRIBEMEDIA KITδΈ­ζ–‡
Login


Product Preview: Semicon West
Search :      Friday, January 09, 2009


U.S. Tech Part Search



Powered by


Terms Of Use

 

 

 

 

 

Hesse & Knipps: Wedge Bonder Improves Cost-of-Ownership
Wedge bonding system.
San Jose, CA, β€” Hesse & Knipps' BONDJET BJ820 is a high-speed fully automatic wedge bonder that offers the flexibility for both high-speed round wire and deep access ribbon and wire bonding. It handles all challenging fine pitch wire bonding applications in a single platform β€” including RF and microwave devices, COB, MCM and hybrids, fiber optics and automotive.

Using aluminum or gold wire or ribbon, the bonder handles up to 6 wires/second. The looping profiles and height consistencies offered by the bonder reportedly meet and exceed RF/Microwave Market expectations.

With high repeatability of 1µm at a balanced encoder resolution of 20nm, the unit offers increased process stability that enables reliable bonding of extremely small bond pads with a larger wire diameter. An efficient 12 x 16.1-in. work area can serve as two or more smaller stations for efficient handling of smaller products or substrates. Coupled with intelligent automation solutions, these features eliminate significant indexing time, resulting in 60 percent greater throughput than competing machines.

According to the company, the wedge bonder offers very high repeatability for high volume production environments and a large control work area for both wire and ribbon bonding, offering greater throughput than competitive technology. It offers a cost-effective alternative for ribbon bonding, which is gaining greater popularity for use in high frequency electronics within the microwave market. Other significant machine capabilities include: 12.5µm to 85µm diameter wire bonding; ribbon bonding from 6 x 35µm to 25 x 250µm; constant loop height and wire length; maintains parallel loops within mixed reference system; and auto teach for linear applications, reducing programming time.

With a footprint of only 720 x 1250mm, the unit can be easily integrated into existing floor plan configurations or new concepts.
Contact: Hesse & Knipps, Inc., 2305 Paragon Dr., San Jose, CA 95131 408-436-9300 fax: 408-436-2822 E-Mail: info@hesse-knipps.us Web: http://www.hesse-knipps.com

See at Semicon West Booth #7357.

 
 

search login