Save. Share. Connect.
Thursday, December 8, 2016
VOLUME -23 NUMBER 7
Publication Date: 07/1/2008
Front Page News
People in the News
Electronic Mfg. Services
Electronic Mfg. Products
Special Feature: Assembly and Packaging
Product Preview: Semicon West
July 2008 Issue
Add Message Board
Samsung Techwin and Valor in Technology Partnership
Yavne, Israel — Samsung Techwin and Valor Computerized Systems Ltd. have established a technology partnership for integration of Samsung Techwin's Pick & Place machine interfaces into Valor's software products. The new partnership will initially result in enhanced machine interfaces to Samsung Techwin's SMT machines for vPlan — Valor's enterprise-level process engineering tool, and vManage — Valor's End to End Manufacturing Monitoring and Control solution.
Keeping pace with the current trends of semiconductor package process, Samsung Techwin provides total SMT solutions, including chip mounters for assembling PC boards for high performance electronic products and communication instruments with light weight, thin profiles and small sizes.
Contact: Valor Computerized Systems, Ltd., Faran St. 4, P.O. Box 152, 70600 Yavne, Israel
+(972) 8-943 2430 fax: +(972) 8-943 2429 E-mail: firstname.lastname@example.org Web:
© 2015 USTECH. All Rights Reserved. |
Contact Us: 610-783-6100 | email@example.com
powered by GIM