Tuesday, June 19, 2018
Publication Date: 07/1/2008
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Autosplice Solderball Pin Technology Receives VISION Award
San Diego, CA — Autosplice's innovative Solderball Pin applied technology received the VISION Award for outstanding achievement in the Packages-Connectors category at IPC APEX. The award was accepted for Autosplice by Carlos Juvera, Global Product Manager. Solderball Pin technology employs a highly conductive copper pin that incorporates a solder ball on the end that interfaces to the host PC board.

Solderball pins add two important attributes to final assembly by providing additional solder and allowing the sub-assembly to drop slightly when the solder becomes liquid. This drop occurs when the weight of the module overcomes the buoyancy of the molten solder. It is made possible by the fact that the bottom end of the pin extends only part way into the solder ball. Therefore Solderball Pin technology is able to automatically align and compensate for PCB co-planarity variances up to 0.020-in during the solder reflow process. The inherent design flexibility of Solderball Pin technology allows designers of PCB-based modules to determine optimal patterns and positioning of individual interconnects, thereby allowing design and layout consistency between new SMT versions and through-hole versions, which allows a smooth roadmap of evolutionary product offerings and surface mountable product options.

Solderball Pin technology is the preferred cost-effective SMT interconnection method in point-of-load power applications of major DC/DC conversion power electronics OEMs.

Contact: Autosplice, Inc., 10121 Barnes Canyon Rd., San Diego, CA 92121 800-535-5538 or 858-535-0077 fax: 858-535-0130 E-mail: connect@autosplice.com Web:

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