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Saturday, December 16, 2017
VOLUME -23 NUMBER 7
Publication Date: 07/1/2008
Front Page News
People in the News
Electronic Mfg. Services
Electronic Mfg. Products
Special Feature: Assembly and Packaging
Product Preview: Semicon West
July 2008 Issue
Front Page News
Quantum Logic Clock Most Accurate Yet
Gaithersburg, MD — An atomic clock that uses an aluminum atom to apply the logic of computers to the peculiarities of the quantum world now rivals the world's most accurate clock, based on a single mercury atom. Both clocks are at least 10 times more accurate than the current U.S. time standard. The measurements, described in a new paper, were made in a yearlong comparison of the two next-generation clocks, both designed and built at the National Institute of Standards and Technology (NIST).
Ericsson, STMicroelectronics form joint venture
Swedish wireless equipment maker LM Ericsson AB and Swiss chip-maker STMicroelectronics NV unveiled plans Wednesday to create a 50-50 joint venture that will make a key component known as chipsets for mobile phones.
SEMI: North American Semiconductor Equipment Industry Posts November 2017 Billings
MILPITAS, CA - North America-based manufacturers of semiconductor equipment posted $2.05 billion in billings worldwide in November 2017 (three-month average basis), according to the November
Equipment Market Data Subscription
(EMDS) Billings Report published today by SEMI.
Avnet Sponsors The Not Impossible Awards Recognizing Emerging Technologies that Improve Lives
Avnet, a leading global technology distributor, today announced its title sponsorship of The Not Impossible Awards, which recognizes the breakthrough achievements of innovators who share the Not Impossible Labs mission to create inventive technology that improves the well-being of others.
aveni® S.A. Extends Copper Interconnects to 5nm and Below for BEOL Integration Using Innovative Electroplating Chemistry
MASSY, France - aveni S.A., developer and manufacturer of market-disrupting wet deposition technologies and chemistries for 2D interconnects and 3D through silicon via packaging, today announced it has obtained results that strongly support the continued use of copper in the back end of line (BEOL) for advanced interconnects, at and beyond the 5nm technology node.
Kilopass NVM OTP IP Achieves 3-Lot Qualification on GLOBALFOUNDRIES 14nm LPP (Low Power Process) Process Technology
SAN JOSE, CA - Kilopass Technology Inc., a leading provider of semiconductor logic embedded non-volatile memory (eNVM) intellectual property (IP), today announced that it successfully achieved a three-lot qualification on GLOBALFOUNDRIES (GF) 14nm LPP (Low Power Process) technology platform for its one-time programmable (OTP) NVM technology.
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