Save. Share. Connect.
Thursday, July 28, 2016
VOLUME - NUMBER
SEMICON West '16
Atlantic Design/ATX/MDM '16
NEPCON China,SMT/Hybrid Pkg,EDS,EWPTE '16
ATX/MDM West '16
productronica,The ASSEMBLY Show, IMAPS, MDM/Minneapolis '15
Nepcon South China '15
SEMICON West '15
ATX/MDM EAST '15
EDS, SMT/Hybrid Pkg,Wire Tech Expo '15
NEPCON China '15
ATX WEST/APEX '15
AATE and IPC MW 11
SMTAI, Autotest, ATX MW/MDM and Assembly '14
SEMICON West '13
Electronics West/MDM and IPC/APEX '13
SEMICON West '14
NEPCON China, SMT/Hybrid Pkg, EDS, NWPTE '14
IPC APEX '14
Electronics West/MDM 10
ATX Midwest, IMAPS, PCB West '13
ATX West '14
ATExpo & IPC MW 07
NEPCON China '13, EDS, more
SEMICON WEST/Intersolar '12
NEPCON China Product Preview '12
Atlantic Design/MDM 10
Electronics West/MDM 11
SEMICON WEST 10
Atlantic Design/MDM 11
ATLANTIC DESIGN & MFG '13
Atlantic Design/MDM 09
SEMICON WEST 08
NEPCON South China '13
ATExpo & IPC MW 08
Electronics West/MDM 08
NEPCON China Product Preview '13
Electronic West/MDM 09
SMTAI and productronica '13
Multi tradeshow Product Preview '12
AATE/IPC Midwest 10
Electronics West/MDM 12
ATE and IPC MW 09
SMTAI and productronica '13
Atlantic Design/MDM 08
HOME / CURRENT ISSUE
Add Message Board
Endicott Intros HPC-Z Interconnect Solution
PCB cross-sections using HPC-Z.
Endicott, NY — Having to drill plated-thru-holes (PTHs) to make signal connections within PC boards may become a thing of the past, thanks to a new technology from Endicott Interconnect Technologies. New HPC-Z interconnections provide signal connections only where desired, with functional isolation for single or double side surface mount partitions.
The HPC-Z interconnect solves thick board drilling and wire density problems, and meets the need for functional isolation, with the capability of isolating high-speed channels on one sub-assembly and low-speed channels on another. It provides interconnections within the board, and eliminates unnecessary PTH drilling.
According to the company, it is only necessary to drill the length of the sub-composite. This can eliminate PTHs that are blocking other wiring channels, which increases wireability, eliminates PTH stubs and results in a thinner and faster board.
HPC-Z provides a "PTH-like" connection at lamination with a pad-to pad connection made with conductive epoxy. Since there is vertical connection with a lamination instead of a PTH, aspect ratios for drill and plate are limited to sub-assembly dimensions. Drilling is reduced; instead of having to drill a 300-mil-thick board through the entire structure to go from signal plane to signal plane, now it is only necessary to drill where needed.
For example, instead of having to drill 3 PTHs all the way though the board with a 10 mil drill for each of 3 sub-assemblies, it is now possible to have 3 PTHs on one, 2 PTHs, on another, and 1 PTH on the other — whatever is needed and no more than are needed. This minimizing of the PTH effect results in increased wiring density due to smaller vias and lands. With HPC-Z, there are more wiring lines available — lines that would have been closed off by PTH drilling.
For more information, contact: Endicott Interconnect Technologies, Inc. 1093 Clark Street, Endicott, NY 13760
866-820-4820; fax: 607-755-7000 Web:
See at APEX Booth #1911.
© 2015 USTECH. All Rights Reserved. |
Contact Us: 610-783-6100 | email@example.com
powered by GIM