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Dage: Advanced Technology Inspection Systems Digital x-ray inspection system. Aylesbury, UK — Dage Precision Industries Ltd. is showcasing its newest developments in x-ray inspection and bondtesting technology, including the XiDAT XD7600NT digital x-ray inspection system equipped with 250nm feature recognition, 2D inspection capability, and computerized tomography (CT). The CT provides 3D modeling and volumetric measurement of solder interconnections for critical applications such as stacked die, MEMS, package-in-package and package-on-package. The XiDAT XD7500VR digital x-ray inspection system with oblique angle viewing and 950nm feature recognition capability is also being displayed. Both the systems are equipped with the company's easy-to-use ImageWizard software providing world class inspection quality. In addition, Dage is exhibiting its newest developments in bondtesting technology including the 4000HS High-Speed Bondtester and 4000 Multi-Purpose Bondtester. The bondtester is particularly suitable for the detection of brittle fracture failures, a phenomenon that can occur with lead-free materials. For more information, contact: Dage Precision Industries, Inc., 48065 Fremont Blvd., Fremont, CA 94538-6541 510-683-3930 Web: http://www.dage-group.com See at Productronica Booth #A2,161.