Thursday, April 26, 2018

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Henkel Intros 2 New Flip-Chip Underfills

Irvine, CA — Henkel has engineered Hysol® FP4581 and Hysol FP4583, two advanced liquid epoxy encapsulants designed for use as underfills for flip chip devices. Hysol FP4581 is a high-purity, liquid epoxy encapsulant formulated specifically for the requirements of high-lead, bumped large ...
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