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Thursday, April 26, 2018
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 The ASSEMBLY Show, MD&M Minneapolis, productronica '17
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SEMICON WEST '17
NEPCON China, SMT/Hybrid Pkg, EWPTE, EDS '17
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ADM Cleveland and APEC '17
SMTAI and IMAPS '16
SEMICON West '16
IPC/APEX '16
NEPCON China '15
ATX WEST/APEX '15
SMTAI, Autotest, ATX MW/MDM and Assembly '14
AATE and IPC MW 11
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electronica 10
APEX 12
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SMTAI '12
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SEMICON WEST 10
Electronics West/MDM 11
Atlantic Design/MDM 11
ATLANTIC DESIGN & MFG '13
SEMICON WEST 08
EDS 07
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NEPCON China Product Preview '13
Autotestcon 11
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ATE and IPC MW 09
Electronics West/MDM 12
NEPCON South China '16
Atlantic Design/ATX/MDM '16
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electronica 08
productronica,The ASSEMBLY Show, IMAPS, MDM/Minneapolis '15
SMTAI '15
SEMICON West '15
Nepcon South China '15
EDS, SMT/Hybrid Pkg,Wire Tech Expo '15
ATX/MDM EAST '15
SEMICON West '13
APEX 11
electronica '14
NEPCON China, SMT/Hybrid Pkg, EDS, NWPTE '14
Electronics West/MDM 10
EDS 08
ATX Midwest, IMAPS, PCB West '13
ATX West '14
EDS 09
APEX 10
Productronica 07
ATExpo & IPC MW 07
NEPCON China '13, EDS, more
electronica '12
SEMICON WEST/Intersolar '12
Atlantic Design/MDM 10
Productronica 11
EDS 11
EDS 10
Atlantic Design/MDM 09
ATExpo & IPC MW 08
NEPCON South China '13
APEX 08
Electronic West/MDM 09
SMTAI and productronica '13
AATE/IPC Midwest 10
Productronica 09
APEX 09
SMTAI and productronica '13
Atlantic Design/MDM 08


Home/Current Issue >  Product Previews >  Productronica 07 > 

Henkel Intros 2 New Flip-Chip Underfills

Irvine, CA — Henkel has engineered Hysol® FP4581™ and Hysol FP4583™, two advanced liquid epoxy encapsulants designed for use as underfills for flip chip devices. Hysol FP4581 is a high-purity, liquid epoxy encapsulant formulated specifically for the requirements of high-lead, bumped large ...
 
 
 
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