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Tuesday, August 22, 2017
VOLUME - NUMBER
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 NEPCON South China '17
SEMICON WEST '17
ATX East / MD&M '17
NEPCON China, SMT/Hybrid Pkg, EWPTE, EDS '17
ADM Cleveland and APEC '17
ATX West and IPC APEX '17
SMTAI and IMAPS '16
SEMICON West '16
IPC/APEX '16
NEPCON China '15
ATX WEST/APEX '15
AATE and IPC MW 11
SMTAI, Autotest, ATX MW/MDM and Assembly '14
Electronics West/MDM and IPC/APEX '13
APEX 12
electronica 10
SEMICON West '14
IPC APEX '14
SMTAI '12
NEPCON China Product Preview '12
Electronics West/MDM 11
SEMICON WEST 10
Atlantic Design/MDM 11
ATLANTIC DESIGN & MFG '13
SEMICON WEST 08
EDS 07
Electronics West/MDM 08
NEPCON China Product Preview '13
Autotestcon 11
Multi tradeshow Product Preview '12
Electronics West/MDM 12
ATE and IPC MW 09
NEPCON South China '16
Atlantic Design/ATX/MDM '16
NEPCON China,SMT/Hybrid Pkg,EDS,EWPTE '16
electronica 08
ATX/MDM West '16
productronica,The ASSEMBLY Show, IMAPS, MDM/Minneapolis '15
SMTAI '15
Nepcon South China '15
SEMICON West '15
ATX/MDM EAST '15
EDS, SMT/Hybrid Pkg,Wire Tech Expo '15
SEMICON West '13
APEX 11
electronica '14
NEPCON China, SMT/Hybrid Pkg, EDS, NWPTE '14
Electronics West/MDM 10
EDS 08
ATX Midwest, IMAPS, PCB West '13
ATX West '14
APEX 10
EDS 09
Productronica 07
ATExpo & IPC MW 07
electronica '12
NEPCON China '13, EDS, more
SEMICON WEST/Intersolar '12
Atlantic Design/MDM 10
Productronica 11
EDS 11
EDS 10
Atlantic Design/MDM 09
NEPCON South China '13
ATExpo & IPC MW 08
APEX 08
Electronic West/MDM 09
SMTAI and productronica '13
AATE/IPC Midwest 10
Productronica 09
APEX 09
SMTAI and productronica '13
Atlantic Design/MDM 08


Home/Current Issue >  Product Previews >  Productronica 07 > 

Henkel Intros 2 New Flip-Chip Underfills

Irvine, CA — Henkel has engineered Hysol® FP4581™ and Hysol FP4583™, two advanced liquid epoxy encapsulants designed for use as underfills for flip chip devices. Hysol FP4581 is a high-purity, liquid epoxy encapsulant formulated specifically for the requirements of high-lead, bumped large ...
 
 
 
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